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1. WO2020071588 - METHOD FOR PRODUCING POLYAMIDEIMIDE FILM, AND POLYAMIDEIMIDE FILM PRODUCED THEREFROM

Publication Number WO/2020/071588
Publication Date 09.04.2020
International Application No. PCT/KR2018/014794
International Filing Date 28.11.2018
IPC
C08J 9/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
9Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
04using blowing gases generated by a previously added blowing agent
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08L 79/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08G 73/14 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
14Polyamide-imides
C09D 179/08 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
179Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/-C09D177/274
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
CPC
C08G 73/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08G 73/14
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
14Polyamide-imides
C08J 5/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08J 9/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
9Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
04using blowing gases generated by a previously added blowing agent
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C09D 179/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
179Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants
  • 에스케이씨코오롱피아이 주식회사 SKCKOLONPI INC. [KR]/[KR]
Inventors
  • 이길남 LEE, Kil Nam
  • 김기훈 KIM, Ki Hoon
  • 최정열 CHOI, Jeong Yeul
Agents
  • 한양특허법인 HANYANG PATENT FIRM
Priority Data
10-2018-011789302.10.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) METHOD FOR PRODUCING POLYAMIDEIMIDE FILM, AND POLYAMIDEIMIDE FILM PRODUCED THEREFROM
(FR) PROCÉDÉ DE PRODUCTION D'UN FILM DE POLYAMIDE-IMIDE ET FILM DE POLYAMIDE-IMIDE PRODUIT À PARTIR DE CELUI-CI
(KO) 폴리아미드이미드 필름의 제조방법 및 이로부터 제조되는 폴리아미드이미드 필름
Abstract
(EN)
The present invention provides a method for producing polyamideimide film, the method comprising: (a) a step in which a dispersion containing at least one diamine monomer and at least one anhydride monomer dispersed in water is reacted under pressure in a pressure vessel at a temperature of 5-400℃, and the resultant reaction product is filtered and dried to obtain a polyamideimide powder; (b) a step in which the polyamideimide powder and carbon black particles are mixed in an organic solvent and then milled to obtain a polyamideimide coating composition; (c) a step for elastically applying the polyamideimide coating composition onto a protective film; and (d) a step for drying and curing the applied coating composition at a temperature of 180℃ or lower to form a polyamideimide thin film on the protective film, wherein the content of the carbon black particles is 5-20 parts by weight with respect to 100 parts by weight of the polyamideimide powder, and the thickness of the polyamideimide thin film is 10 µm or less.
(FR)
La présente invention concerne un procédé de production d'un film de polyamide-imide, le procédé comprenant : (a) une étape dans laquelle une dispersion contenant au moins un monomère de diamine et au moins un monomère d'anhydride dispersés dans de l'eau est mise à réagir sous pression dans un récipient sous pression à une température de 5 à 400 °C, et le produit de réaction résultant est filtré et séché pour obtenir une poudre de polyamide-imide; (b) une étape dans laquelle la poudre de polyamide-imide et des particules de noir de carbone sont mélangées dans un solvant organique et ensuite broyées pour obtenir une composition de revêtement de polyamide-imide; (c) une étape d'application élastique de la composition de revêtement de polyamide-imide sur un film de protection; et (d) une étape de séchage et de durcissement de la composition de revêtement appliquée à une température de 180 °C ou moins pour former un film mince de polyamide-imide sur le film de protection, la teneur en particules de noir de carbone étant de 5 à 20 parties en poids par rapport à 100 parties en poids de la poudre de polyamide-imide, et l'épaisseur du film mince de polyamide-imide étant de 10 µm ou moins.
(KO)
본 발명은, (a) 1종 이상의 디아민 단량체와 1종 이상의 안하이드라이드 단량체를 물에 분산시킨 분산액을 압력 용기에 넣고, 5 내지 400℃의 온도 및 가압 조건에서 반응시켜 얻은 반응 생성물을 여과하고 건조시켜 폴리아미드이미드 분말을 얻는 단계; (b) 상기 폴리아미드이미드 분말 및 카본블랙 입자를 유기용매 중에 혼합한 후 밀링하여 폴리아미드이미드 코팅 조성물을 얻는 단계; (c) 상기 폴리아미드이미드 코팅 조성물을 보호 필름 상에 유연 도포하는 단계; 및 (d) 도포된 상기 코팅 조성물을 180℃ 이하의 온도에서 건조 및 경화하여 보호 필름 상에 폴리아미드이미드 박막을 형성하는 단계를 포함하고, 상기 카본블랙 입자의 함량은 상기 폴리아미드이미드 분말 100 중량부 대비 5 내지 20 중량부이고, 상기 폴리아미드이미드 박막의 두께가 10 ㎛ 이하인, 폴리아미드이미드 필름의 제조방법을 제공한다.
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