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1. WO2020071492 - MODULE

Publication Number WO/2020/071492
Publication Date 09.04.2020
International Application No. PCT/JP2019/039162
International Filing Date 03.10.2019
IPC
H05K 9/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
H01L 23/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/28 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
H01L 25/04 2014.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
CPC
H01L 23/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
H01L 25/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
H01L 25/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
H05K 9/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 大坪 喜人 OTSUBO, Yoshihito
  • 小田 哲也 ODA, Tetsuya
Agents
  • 特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.
Priority Data
2018-19026305.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) MODULE
(FR) MODULE
(JA) モジュール
Abstract
(EN)
A module (101) is equipped with: a substrate having a principal surface (1u); a plurality of electronic components (41, 42, 43) positioned on the principal surface (1u); a sealing resin (3) which covers the principal surface (1u) and the plurality of electronic components (41, 42, 43), and has a trench (16) between some of the electronic components (41, 42, 43); a ground electrode positioned on the principal surface (1u); a conductive layer (6) for covering the sealing resin (3); and a magnetic member. The conductive layer (6) is electrically connected to the ground electrode by a connecting conductor (62) provided so as to pass through the sealing resin (3). The magnetic member includes a magnetic member plate-shaped section positioned so as to cover the sealing resin (3) and a magnetic member wall-shaped section (52) positioned in a wall shape inside the trench (16). The connecting conductor (62) and the magnetic member wall-shaped section (52) are both formed inside the trench (16) and fill the trench (16) in said formed state.
(FR)
La présente invention concerne un module (101) équipé : d'un substrat ayant une surface principale (1u) ; d'une pluralité de composants électroniques (41, 42, 43) positionnés sur la surface principale (1u) ; d'une résine d'étanchéité (3) qui recouvre la surface principale (1u) et la pluralité de composants électroniques (41, 42, 43), et est pourvue d'une tranchée (16) entre certains des composants électroniques (41, 42, 43) ; d'une électrode de masse positionnée sur la surface principale (1u) ; d'une couche conductrice (6) destinée à recouvrir la résine d'étanchéité (3) ; et d'un élément magnétique. La couche conductrice (6) est électriquement connectée à l'électrode de masse par un conducteur de connexion (62) disposé de manière à traverser la résine d'étanchéité (3). L'élément magnétique comprend une section en forme de plaque d'élément magnétique positionnée de manière à recouvrir la résine d'étanchéité (3) et une section en forme de paroi d'élément magnétique (52) positionnée selon une forme de paroi à l'intérieur de la tranchée (16). Le conducteur de connexion (62) et la section en forme de paroi d'élément magnétique (52) sont tous deux formés à l'intérieur de la tranchée (16) et remplissent la tranchée (16) dans ledit état formé.
(JA)
モジュール(101)は、主面(1u)を有する基板と、主面(1u)上に配置された複数の電子部品(41,42,43)と、主面(1u)および複数の電子部品(41,42,43)を覆い、前記複数の電子部品のいずれかの間にトレンチ(16)を有する封止樹脂(3)と、主面(1u)に配置された接地電極と、封止樹脂(3)を覆う導電層(6)と、磁性部材とを備える。導電層(6)は、封止樹脂(3)を貫通するように配置された接続導体(62)によって、前記接地電極に電気的に接続されている。前記磁性部材は、封止樹脂(3)を覆うように配置された磁性部材板状部と、トレンチ(16)内に壁状に配置された磁性部材壁状部(52)とを含む。接続導体(62)および磁性部材壁状部(52)は、共にトレンチ(16)内に形成された状態でトレンチ(16)を満たしている。
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