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1. WO2020071449 - IMAGING APPARATUS, LASER PROCESSING APPARATUS, AND IMAGING METHOD

Publication Number WO/2020/071449
Publication Date 09.04.2020
International Application No. PCT/JP2019/038993
International Filing Date 02.10.2019
IPC
B23K 26/00 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
B23K 26/02 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
B23K 26/53 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
CPC
B23K 26/00
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
B23K 26/02
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
B23K 26/046
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
046Automatically focusing the laser beam
B23K 26/53
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Applicants
  • 浜松ホトニクス株式会社 HAMAMATSU PHOTONICS K.K. [JP]/[JP]
Inventors
  • 坂本 剛志 SAKAMOTO Takeshi
  • 鈴木 康孝 SUZUKI Yasutaka
  • 佐野 いく SANO Iku
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 黒木 義樹 KUROKI Yoshiki
  • 柴山 健一 SHIBAYAMA Kenichi
Priority Data
2018-18902604.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) IMAGING APPARATUS, LASER PROCESSING APPARATUS, AND IMAGING METHOD
(FR) APPAREIL D'IMAGERIE, APPAREIL DE TRAITEMENT AU LASER, ET PROCÉDÉ D'IMAGERIE
(JA) 撮像装置、レーザ加工装置、及び、撮像方法
Abstract
(EN)
An imaging apparatus is provided with: a first imaging unit (4) for imaging an object (11) with light transmitted through the object; and a first control unit (8) for controlling the first imaging unit, wherein, at the time of performing alignment of laser light illuminating position with respect to a first line (15a) after forming a modified region (12) in the object along the first line, the first control unit executes a first imaging process for controlling the first imaging unit to image the modified region formed along the first line, and/or a region including the crack extending from the modified region.
(FR)
L’invention concerne un appareil d'imagerie équipé : d'une première unité d'imagerie (4) destinée à imager un objet (11) à l’aide d’une lumière émise à travers l'objet ; et d'une première unité de commande (8) destinée à commander la première unité d'imagerie. Lors de la mise en œuvre d'un alignement de la position d'éclairage de lumière laser par rapport à une première ligne (15a) après la formation d'une région modifiée (12) dans l'objet le long de la première ligne, la première unité de commande exécute un premier processus d'imagerie permettant de commander la première unité d'imagerie afin d’imager la région modifiée formée le long de la première ligne, et/ou une région comprenant la fissure s'étendant à partir de la région modifiée.
(JA)
対象物(11)を透過する光により前記対象物を撮像する第1撮像ユニット(4)と、前記第1撮像ユニットを制御する第1制御部(8)と、を備え、前記第1制御部は、第1ライン(15a)に沿って前記対象物に改質領域(12)が形成された後であってレーザ光の照射位置の前記第1ラインに対するアライメントが行われるタイミングにおいて、前記第1ラインに沿って形成された前記改質領域、及び/又は、当該改質領域から延びる前記亀裂を含む領域を撮像するように、前記第1撮像ユニットを制御する第1撮像処理を実行する、撮像装置。
Also published as
Latest bibliographic data on file with the International Bureau