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1. WO2020071388 - HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD

Publication Number WO/2020/071388
Publication Date 09.04.2020
International Application No. PCT/JP2019/038804
International Filing Date 01.10.2019
IPC
B29C 33/68 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
56Coatings; Releasing, lubricating or separating agents
68Release sheets
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/603 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
603involving the application of pressure, e.g. thermo-compression bonding
CPC
B29C 33/68
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
56Coatings ; , e.g. enameled or galvanised; Releasing, lubricating or separating agents
68Release sheets
B29C 43/32
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
32Component parts, details or accessories; Auxiliary operations
C08J 5/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 秋葉 府統 AKIBA Kurato
  • 吉松 王彦 YOSHIMATSU Kimihiko
Agents
  • 鎌田 耕一 KAMADA Koichi
Priority Data
2018-18907104.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD
(FR) FEUILLE DE DÉCOLLEMENT RÉSISTANTE À LA CHALEUR ET PROCÉDÉ DE LIAISON PAR THERMOCOMPRESSION
(JA) 耐熱離型シート及び熱圧着方法
Abstract
(EN)
During thermocompression bonding of a compression bonding target by a heating/pressing head, this heat resistant release sheet is arranged between the compression bonding target and the heating/pressing head and prevents adhesion between the compression target and the heating/pressing head. The surface hardness at 300°C is less than or equal to 15%, represented by the degree of indentation A300 given by the formula A300(%) = (d300/t0)×100. However, t0 is the thickness of the heat-resistant release sheet at room temperature (20°C). d300 is the indentation amount of a needle penetration probe at 300°C in the heat-resistant release sheet, evaluated by thermomechanical analysis (TMA) based on the following measurement conditions. [Measurement conditions] Measurement mode: needle penetration mode, temperature rise measurement; Form and tip diameter of needle penetration probe: cylindrical and 1 mmφ; Applied pressure: 1 MPa; Temperature rise start temperature and rate of temperature rise: 20°C, 10°C/min. With this heat resistant release sheet, it is possible to reliably handle predicted further rises in the thermocompression temperature.
(FR)
La présente invention concerne, pendant la liaison par thermocompression d’une cible de liaison par compression par une tête de chauffage/compression, une feuille de décollement résistante à la chaleur qui est disposée entre la cible de liaison par compression et la tête de chauffage/compression et qui empêche l’adhérence entre la cible de compression et la tête de chauffage/compression. La dureté de surface à 300 °C est inférieure ou égale à 15 %, représentée par le degré d’indentation A300 donné par la formule A300(%) = (d300/t0) x 100. Cependant, t0 est l’épaisseur de la feuille de décollement résistante à la chaleur à la température ambiante (20 °C). d300 est la quantité d’indentation d’une sonde de pénétration d’aiguille à 300 °C dans la feuille de décollement résistante à la chaleur, évaluée par analyse thermomécanique (TMA) sur la base des conditions de mesure suivantes. [Conditions de mesure] mode de mesure : mode de pénétration de l’aiguille, mesure de l'échauffement ; forme et diamètre de la pointe de la sonde de pénétration d’aiguille : cylindrique et 1 mmφ ; pression appliquée : 1 MPa ; température de début d'échauffement et vitesse d'échauffement : 20 °C, 10 °C/min. Ainsi, grâce à cette feuille de décollement résistante à la chaleur, il est possible de prédire de manière fiable les échauffements ultérieurs de la thermocompression.<b></b> <b></b>
(JA)
本開示の耐熱離型シートは、熱加圧ヘッドによる圧着対象物の熱圧着時に圧着対象物と熱加圧ヘッドとの間に配置されて、圧着対象物と熱加圧ヘッドとの固着を防ぐためのシートであり、300℃における表面硬さが、式:A300(%)=(d300/t0)×100により与えられる押込み度A300により表示して、15%以下である。ただし、t0は、常温(20℃)における耐熱離型シートの厚さである。d300は、以下の測定条件に基づく熱機械分析(TMA)により評価した、耐熱離型シートに対する300℃での針入プローブの押込み量である。[測定条件]・測定モード:針入モード、昇温測定、 ・針入プローブの形状及び先端径:円柱状及び1mmφ、 ・印加圧力:1MPa ・昇温開始温度及び昇温速度:20℃及び10℃/分。本開示の耐熱離型シートによれば、予想される熱圧着温度のさらなる上昇に対してより確実に対応できる。
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