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1. WO2020071386 - HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD

Publication Number WO/2020/071386
Publication Date 09.04.2020
International Application No. PCT/JP2019/038802
International Filing Date 01.10.2019
IPC
B29C 33/68 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
56Coatings; Releasing, lubricating or separating agents
68Release sheets
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/603 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
603involving the application of pressure, e.g. thermo-compression bonding
CPC
B29C 33/68
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
56Coatings ; , e.g. enameled or galvanised; Releasing, lubricating or separating agents
68Release sheets
B29C 43/32
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
32Component parts, details or accessories; Auxiliary operations
C08J 5/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
H01L 2224/83203
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
832Applying energy for connecting
83201Compression bonding
83203Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
H01L 24/75
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
75Apparatus for connecting with bump connectors or layer connectors
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 秋葉 府統 AKIBA Kurato
Agents
  • 鎌田 耕一 KAMADA Koichi
Priority Data
2018-18906804.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD
(FR) FEUILLE DE PROTECTION AMOVIBLE RÉSISTANTE À LA CHALEUR ET PROCÉDÉ DE LIAGE PAR THERMO-COMPRESSION
(JA) 耐熱離型シート及び熱圧着方法
Abstract
(EN)
This heat-resistant release sheet is disposed between a compression bonding target and a thermocompression head when thermocompression bonding of the compression bonding target using the thermocompression head is carried out, and the sheet thereby prevents bonding between the compression bonding target and the thermocompression head. The sheet includes a polytetrafluoroethylene (PTFE) or modified PTFE sheet. However, the content ratio of tetrafluoroethylene (TFE) units in the modified PTFE is at least 99% by mass. With this heat-resistant release sheet, demands for shortening of the time (work time) required for thermocompression bonding can be met with greater certainty.
(FR)
L'invention concerne une feuille de protection amovible résistante à la chaleur qui est disposée entre une cible de liage par compression et une tête de thermo-compression lors de la réalisation du liage par thermo-compression de la cible de liage par compression en utilisant la tête de thermo-compression, et la feuille empêche ainsi le liage entre la cible de liage par compression et la tête de thermo-compression. La feuille comprend une feuille de polytétrafluoroéthylène (PTFE) ou de PTFE modifié. Toutefois, la teneur en unités de tétrafluoroéthylène (TFE) dans le PTFE modifié est d'au moins 99 % massiques. Cette feuille de protection amovible résistante à la chaleur permet de répondre avec une plus grande certitude aux demandes de raccourcissement du temps (temps de travail) requis pour un liage par thermo-compression.
(JA)
本開示の耐熱離型シートは、熱加圧ヘッドによる圧着対象物の熱圧着時に圧着対象物と熱加圧ヘッドとの間に配置されて、圧着対象物と熱加圧ヘッドとの固着を防ぐためのシートであって、ポリテトラフルオロエチレン(PTFE)又は変性PTFEのシートを含む。ただし、変性PTFEにおけるテトラフルオロエチレン(TFE)単位の含有率は99質量%以上である。本開示の耐熱離型シートによれば、熱圧着に要する時間(ワークタイム)の短縮の要求に対してもより確実に対応できる。
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