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1. WO2020071206 - SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

Publication Number WO/2020/071206
Publication Date 09.04.2020
International Application No. PCT/JP2019/037585
International Filing Date 25.09.2019
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
B05C 11/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
B05C 11/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface; Control of the thickness of a coating
08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
B05C 11/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05D 1/40 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
40Distributing applied liquids or other fluent materials by members moving relatively to surface
B05D 3/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
CPC
B05C 11/00
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
B05C 11/08
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; ; Controlling means therefor
08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
B05C 11/10
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05D 1/40
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
40Distributing applied liquids or other fluent materials by members moving relatively to surface
B05D 3/00
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 3/10
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
10by other chemical means
Applicants
  • 株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP]/[JP]
Inventors
  • 猶原 英司 NAOHARA Hideji
  • 沖田 有史 OKITA Yuji
  • 角間 央章 KAKUMA Hiroaki
  • 増井 達哉 MASUI Tatsuya
Agents
  • 吉竹 英俊 YOSHITAKE Hidetoshi
  • 有田 貴弘 ARITA Takahiro
Priority Data
2018-18998005.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置および基板処理方法
Abstract
(EN)
Provided is a substrate processing device capable of imaging a liquid column of processing fluid which is discharged onto the end section of a substrate. The substrate processing device is equipped with a substrate-holding part 20, a cup member 40, a raising/lowering mechanism 44, a first nozzle 31 and a camera 70. The substrate-holding part 20 holds a substrate W and rotates the substrate W. The cup member 40 surrounds the outer circumference of the substrate-holding part 20. The raising/lowering mechanism 44 raises the cup member 40 in a manner such that the upper end section of the cup member 40 is positioned at an upper end position which is higher than the substrate W held by the substrate-holding part 20. The first nozzle 31 has a discharge port located in a position which is lower than is the upper end position, and discharges the first processing fluid from the discharge port onto the end section of the substrate W. The camera 70 images an imaging region which includes the first processing fluid discharged from the discharge port of the first nozzle 31, and is seen from an imaging position above the substrate W.
(FR)
L'invention concerne un dispositif de traitement de substrat capable d'imager une colonne de liquide de fluide de traitement qui est évacuée sur la section d'extrémité d'un substrat. Le dispositif de traitement de substrat est équipé d'une partie de maintien de substrat 20, d'un élément coupelle 40, d'un mécanisme d'élévation/abaissement 44, d'une première buse 31 et d'une caméra 70. La partie de maintien de substrat 20 maintient un substrat W et fait tourner le substrat W. L'élément coupelle 40 entoure la circonférence externe de la partie de maintien de substrat 20. Le mécanisme d'élévation/abaissement 44 lève l'élément coupelle 40 de telle sorte que la section d'extrémité supérieure de l'élément coupelle 40 est positionnée à une position d'extrémité supérieure qui est supérieure au substrat W maintenu par la partie de maintien de substrat 20. La première buse 31 comprend un orifice de décharge situé dans une position qui est inférieure à la position d'extrémité supérieure, et évacue le premier fluide de traitement depuis l'orifice de décharge sur la section d'extrémité du substrat W. La caméra 70 image une région d'imagerie qui comprend le premier fluide de traitement évacué à partir de l'orifice de décharge de la première buse 31, et est vue à partir d'une position d'imagerie au-dessus du substrat W.
(JA)
基板の端部に吐出された液柱状の処理液を撮像できる基板処理装置を提供する。基板処理装置は基板保持部20とカップ部材40と昇降機構44と第1ノズル31とカメラ70とを備える。基板保持部20は、基板Wを保持し、基板Wを回転させる。カップ部材40は基板保持部20の外周を囲む。昇降機構44はカップ部材40の上端部が、基板保持部20に保持された基板Wよりも高い上端位置に位置するように、カップ部材40を上昇させる。第1ノズル31は上端位置よりも低い位置に吐出口を有し、吐出口から基板Wの端部へと第1処理液を吐出する。カメラ70は、第1ノズル31の吐出口から吐出される第1処理液を含む撮像領域であって基板Wの上方の撮像位置から見た撮像領域を撮像する。
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