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1. WO2020071153 - RESIN COMPOSITION, SUBSTRATE-ATTACHED FILM, METAL/RESIN LAMINATED BODY AND SEMICONDUCTOR DEVICE

Publication Number WO/2020/071153
Publication Date 09.04.2020
International Application No. PCT/JP2019/036961
International Filing Date 20.09.2019
IPC
C08L 15/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
15Compositions of rubber derivatives
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
B32B 27/30 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
30comprising vinyl resin; comprising acrylic resin
B32B 27/34 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
34comprising polyamides
B32B 27/38 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
38comprising epoxy resins
C08K 3/013 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
013Fillers, pigments or reinforcing additives
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is next to another layer of the same or of a different material
08of synthetic resin
B32B 27/30
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
30comprising vinyl ; (co)polymers; comprising acrylic (co)polymers
B32B 27/34
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
34comprising polyamides
B32B 27/38
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
38comprising epoxy resins
C08K 3/013
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
01characterized by their specific function
013Fillers, pigments or reinforcing additives
C08L 15/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
15Compositions of rubber derivatives
Applicants
  • ナミックス株式会社 NAMICS CORPORATION [JP]/[JP]
Inventors
  • 小松 史和 KOMATSU Fumikazu
  • 青木 一生 AOKI Issei
  • 高杉 寛史 TAKASUGI Hiroshi
  • 日馬 宗俊 KUSAMA Munetoshi
Agents
  • アイアット国際特許業務法人 IAT WORLD PATENT LAW FIRM
Priority Data
2018-18751502.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION, SUBSTRATE-ATTACHED FILM, METAL/RESIN LAMINATED BODY AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE, FILM FIXÉ À UN SUBSTRAT, CORPS STRATIFIÉ MÉTAL/RÉSINE ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 樹脂組成物、基材付フィルム、金属/樹脂積層体および半導体装置
Abstract
(EN)
Provided is a resin composition suitable for an insulation adhesive layer for an aluminum-based substrate. This resin composition is heat-resistant and adhesive and, once cured, has a low elasticity in a low temperature range that is 0°C or less. The resin composition includes (A) a modified elastomer having an acid anhydride group, (B) a solvent-soluble polyimide resin, and (C) an epoxy resin.
(FR)
L'invention concerne une composition de résine appropriée pour une couche adhésive d'isolation pour un substrat à base d'aluminium. Cette composition de résine est résistante à la chaleur et adhésive et, une fois durcie, présente une faible élasticité dans une plage de basses températures inférieures ou égales à 0 °C. La composition de résine comprend (A) un élastomère modifié ayant un groupe anhydride d'acide, (B) une résine polyimide soluble dans un solvant, et (C) une résine époxy.
(JA)
アルミベース基板の絶縁接着層に適した樹脂組成物を提供する。この樹脂組成物は、その硬化物が0℃以下の低温領域において低弾性であり、かつ、耐熱性および接着性を兼ね備えている。 樹脂組成物は、(A)酸無水物基を有する変性エラストマー、(B)溶剤可溶性ポリイミド樹脂、および、(C)エポキシ樹脂を含む。
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