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1. WO2020071102 - SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND VEHICLE

Publication Number WO/2020/071102
Publication Date 09.04.2020
International Application No. PCT/JP2019/036307
International Filing Date 17.09.2019
IPC
H01L 25/07 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 23/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
CPC
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 23/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
H01L 25/07
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/00
H01L 25/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
Applicants
  • 富士電機株式会社 FUJI ELECTRIC CO., LTD. [JP]/[JP]
Inventors
  • 中山 智矢 NAKAYAMA Tomoya
  • 大澤 彰浩 OSAWA Akihiro
Agents
  • 龍華国際特許業務法人 RYUKA IP LAW FIRM
Priority Data
2018-18963205.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND VEHICLE
(FR) DISPOSITIF À SEMI-CONDUCTEUR, MODULE À SEMI-CONDUCTEUR ET VÉHICULE
(JA) 半導体装置、半導体モジュールおよび車両
Abstract
(EN)
The present invention provides a semiconductor device which is provided with: a circuit board; a wiring pattern; a first semiconductor chip and a second semiconductor chip, which are arranged in a first direction within a plane that is parallel to the board surface; a first lead frame which connects the first semiconductor chip and the wiring pattern to each other; and a second lead frame which connects the second semiconductor chip and the wiring pattern to each other. This semiconductor device is configured such that: each of the first lead frame and the second lead frame has a chip bonding part that is provided above at least a part of the corresponding semiconductor chip, a wiring line bonding part that is provided above at least a part of the wiring pattern, and a bridge part that connects the chip bonding part and the wiring line bonding part to each other; and the distance between the bridge part of the first lead frame and the bridge part of the second lead frame is shorter than the distance between the chip bonding part of the fist lead frame and the chip bonding part of the second lead frame in the first direction.
(FR)
La présente invention concerne un dispositif à semi-conducteur qui est pourvu : d'une carte de circuit imprimé ; d'un motif de câblage ; d'une première puce semi-conductrice et d'une seconde puce semi-conductrice, qui sont agencées dans une première direction dans un plan qui est parallèle à la surface de carte ; d'une première grille de connexion qui connecte la première puce semi-conductrice et le motif de câblage l'une à l'autre ; et d'une seconde grille de connexion qui connecte la seconde puce semi-conductrice et le motif de câblage l'un à l'autre. Ce dispositif à semi-conducteur est conçu de telle sorte que : chacun des éléments parmi la première grille de connexion et la seconde grille de connexion a une partie de liaison de puce qui est disposée au-dessus d'au moins une partie de la puce semi-conductrice correspondante, une partie de liaison de ligne de câblage qui est disposée au-dessus d'au moins une partie du motif de câblage, et une partie pont qui relie la partie de liaison de puce et la partie de liaison de ligne de câblage l'une à l'autre ; et la distance entre la partie pont de la première grille de connexion et la partie pont de la seconde grille de connexion est plus courte que la distance entre la partie de liaison de puce de la première grille de connexion et la partie de liaison de puce de la seconde grille de connexion dans la première direction.
(JA)
回路基板と、配線パターンと、基板面と平行な平面内において第1方向に沿って設けられた、第1半導体チップおよび第2半導体チップと、第1半導体チップと配線パターンを接続する第1リードフレームと、第2半導体チップと配線パターンを接続する第2リードフレームとを備え、第1リードフレームおよび第2リードフレームは、それぞれ半導体チップの少なくとも一部の上方に設けられたチップ接合部と、配線パターンの少なくとも一部の上方に設けられた配線接合部と、チップ接合部と配線接合部とを接続する架橋部と、を有し、第1方向において、第1リードフレームの架橋部と第2リードフレームの架橋部との間隔が、第1リードフレームのチップ接合部と第2リードフレームのチップ接合部との間隔よりも小さい、半導体装置を提供する。
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