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1. WO2020071036 - THERMOELECTRIC CONVERSION MODULE, AND COOLING DEVICE, TEMPERATURE MEASUREMENT DEVICE, HEAT FLOW SENSOR, OR POWER GENERATION DEVICE USING SAME

Publication Number WO/2020/071036
Publication Date 09.04.2020
International Application No. PCT/JP2019/034679
International Filing Date 04.09.2019
IPC
H01L 35/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device
F25B 21/02 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION OR SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
21Machines, plant, or systems, using electric or magnetic effects
02using Peltier effect; using Nernst-Ettinghausen effect
H02N 11/00 2006.01
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
11Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
CPC
F25B 21/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
21Machines, plant, or systems, using electric or magnetic effects
02using Peltier effect; using Nernst-Ettinghausen effect
H01L 35/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device ; including details about, e.g., housing, insulation, geometry, module
H02N 11/00
HELECTRICITY
02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
11Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
Applicants
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
Inventors
  • 志水 大助 SHIMIZU, Daisuke
  • 池内 宏樹 IKEUCHI, Hiroki
Agents
  • 新居 広守 NII, Hiromori
  • 寺谷 英作 TERATANI, Eisaku
  • 道坂 伸一 MICHISAKA, Shinichi
Priority Data
62/741,23004.10.2018US
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) THERMOELECTRIC CONVERSION MODULE, AND COOLING DEVICE, TEMPERATURE MEASUREMENT DEVICE, HEAT FLOW SENSOR, OR POWER GENERATION DEVICE USING SAME
(FR) MODULE DE CONVERSION THERMOÉLECTRIQUE ET DISPOSITIF DE REFROIDISSEMENT, DISPOSITIF DE MESURE DE TEMPÉRATURE, CAPTEUR DE FLUX DE CHALEUR OU DISPOSITIF DE PRODUCTION D'ÉNERGIE L'UTILISANT
(JA) 熱電変換モジュールおよびそれを用いた冷却装置または温度測定装置または熱流センサまたは発電装置
Abstract
(EN)
A thermoelectric conversion module is provided with: a thermoelectric element group (3) formed by arraying a plurality of first semiconductor elements (1) and a plurality of second semiconductor elements (2); a first substrate (4) bonded to the upper side of the thermoelectric element group (3); a second substrate (5) bonded to the lower side of the thermoelectric element group (3); and a lead-out section (6) led out from one end of at least one substrate of the first substrate (4) and the second substrate (5) to the outside, and is characterized in that the width of the lead-out section (6) in a direction perpendicular to the lengthwise direction thereof is such that a first width (7) of a first region (6a) close to the first substrate (4) or the second substrate (5) is larger than a second width (8) of a second region (6b) farther from the first substrate (4) or the second substrate (5) than the first region (6a).
(FR)
L'invention concerne un module de conversion thermoélectrique comprenant : un groupe d'éléments thermoélectriques (3) formés par agencement d'une pluralité de premiers éléments semi-conducteurs (1) et d'une pluralité de seconds éléments semi-conducteurs (2) ; un premier substrat (4) lié au côté supérieur du groupe d'éléments thermoélectriques (3) ; un second substrat (5) lié au côté inférieur du groupe d'éléments thermoélectriques (3) ; et une section de sortie (6) sortant d'une extrémité d'au moins un substrat du premier substrat (4) et le second substrat (5) vers l'extérieur, et est caractérisée en ce que la largeur de la section de sortie (6) dans une direction perpendiculaire à la direction longitudinale de celle-ci est telle qu'une première largeur (7) d'une première région (6a) proche du premier substrat (4) ou du second substrat (5) est plus grande qu'une seconde largeur (8) d'une seconde région (6b) plus éloignée du premier substrat (4) ou du second substrat (5) que la première région (6a).
(JA)
熱電変換モジュールは、複数の第1の半導体素子(1)と、複数の第2の半導体素子(2)とを配列してなる熱電素子群(3)と、熱電素子群(3)の上側に接合された第1の基板(4)と、熱電素子群(3)の下側に接合された第2の基板(5)と、第1の基板(4)または第2の基板(5)の少なくとも一方の基板の一端から外部まで引き出された引き出し部(6)とを備え、引き出し部(6)の長手方向に垂直な方向の幅は、第1の基板(4)または第2の基板(5)に近い第1の領域(6a)の第1の幅(7)が、第1の基板(4)または第2の基板(5)から第1の領域(6a)よりも遠い第2の領域(6b)の第2の幅(8)よりも大きいことを特徴とする。
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