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1. WO2020070919 - GROUNDING STRUCTURE FOR HIGH FREQUENCY CIRCUIT BOARD

Publication Number WO/2020/070919
Publication Date 09.04.2020
International Application No. PCT/JP2019/020861
International Filing Date 27.05.2019
IPC
H01P 5/08 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5Coupling devices of the waveguide type
08for linking lines or devices of different kinds
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01P 3/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
H01P 5/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5Coupling devices of the waveguide type
02with invariable factor of coupling
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
CPC
H01L 23/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01P 3/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
H01P 5/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5Coupling devices of the waveguide type
02with invariable factor of coupling
H01P 5/08
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5Coupling devices of the waveguide type
08for linking dissimilar lines or devices
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/34
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
Applicants
  • 株式会社 東芝 KABUSHIKI KAISHA TOSHIBA [JP]/[JP]
  • 東芝インフラシステムズ株式会社 TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION [JP]/[JP]
Inventors
  • 旭 保彰 ASAHI, Yasuaki
  • 小島 治夫 KOJIMA, Haruo
Agents
  • 日向寺 雅彦 HYUGAJI, Masahiko
  • 小崎 純一 KOZAKI, Junichi
  • 市川 浩 ICHIKAWA, Hiroshi
  • 白井 達哲 SHIRAI, Tatsunori
  • 内田 敬人 UCHIDA, Takahito
  • 竹内 功 TAKEUCHI, Isao
Priority Data
2018-19009205.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) GROUNDING STRUCTURE FOR HIGH FREQUENCY CIRCUIT BOARD
(FR) STRUCTURE DE MISE À LA MASSE POUR CARTE DE CIRCUIT IMPRIMÉ HAUTE FRÉQUENCE
(JA) 高周波回路基板の接地構造
Abstract
(EN)
This grounding structure for a high-frequency circuit board has: a dielectric substrate; a rear surface grounding electrode; an upper grounding electrode; and a microstrip line upper electrode. The dielectric substrate has a first surface and a second surface, the dielectric substrate being provided with a first through hole. A first opening of the first through hole in the first surface is smaller than a second opening of the first through hole in the second surface. A first ground conductor layer is provided inside the first through hole. A rear surface electrode is provided on the second surface, and is connected to the first ground conductor layer. The upper grounding electrode is provided on the first surface, and is connected to the first ground conductor layer. The microstrip line upper electrode is provided on the first surface.
(FR)
L'invention concerne une structure de mise à la masse pour carte de circuit haute fréquence comprenant : un substrat diélectrique ; une électrode de mise à la masse de surface arrière ; une électrode de mise à la masse supérieure ; et une électrode supérieure de ligne microruban. Le substrat diélectrique a une première surface et une seconde surface, le substrat diélectrique comprenant un premier trou traversant. Une première ouverture du premier trou traversant dans la première surface est plus petite qu'une seconde ouverture du premier trou traversant dans la seconde surface. Une première couche conductrice de masse est disposée à l'intérieur du premier trou traversant. Une électrode de surface arrière est disposée sur la seconde surface, et est connectée à la première couche conductrice de masse. L'électrode de mise à la masse supérieure est disposée sur la première surface, et est connectée à la première couche conductrice de masse. L'électrode supérieure de ligne microruban est disposée sur la première surface.
(JA)
高周波回路基板の接地構造は、誘電体基板と、裏面接地電極と、上部接地電極と、マイクロストリップ線路上部電極と、を有する。誘電体基板は、第1の面と、第2の面と、を有し、第1のスルーホールが設けられる。第1の面における第1のスルーホールの第1の開口は、第2の面における第1のスルーホールの第2の開口よりも小さい。第1の接地導体層は、第1のスルーホール内に設けられる。裏面電極は、第2の面に設けられ、かつ第1の接地導体層と接続される。上部接地電極は、第1の面に設けられ、かつ第1の接地導体層と接続される。マイクロストリップ線路上部電極は、第1の面に設けられる。
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