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1. WO2020070148 - DEVICE AND METHOD FOR PROCESSING A MULTIPLICITY OF SEMICONDUCTOR CHIPS

Publication Number WO/2020/070148
Publication Date 09.04.2020
International Application No. PCT/EP2019/076626
International Filing Date 01.10.2019
IPC
G01R 31/26 2020.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
G01R 1/04 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
04Housings; Supporting members; Arrangements of terminals
G01R 31/28 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
CPC
G01R 1/0408
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
G01R 31/2635
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
2607Circuits therefor
2632for testing diodes
2635Testing light-emitting diodes, laser diodes or photodiodes
G01R 31/2887
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2886Features relating to contacting the IC under test, e.g. probe heads; chucks
2887involving moving the probe head or the IC under test; docking stations
Applicants
  • OSRAM OPTO SEMICONDUCTORS GMBH [DE]/[DE]
Inventors
  • BERGLER, Michael
  • ZEISEL, Roland
Agents
  • EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH
Priority Data
10 2018 124 492.404.10.2018DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VORRICHTUNG UND VERFAHREN ZUR PROZESSIERUNG EINER VIELZAHL VON HALBLEITERCHIPS
(EN) DEVICE AND METHOD FOR PROCESSING A MULTIPLICITY OF SEMICONDUCTOR CHIPS
(FR) DISPOSITIF ET PROCÉDÉ DE TRAITEMENT D'UNE PLURALITÉ DE PUCES SEMI-CONDUCTRICES
Abstract
(DE)
Eine Vorrichtung zur Prozessierung einer Vielzahl von Halbleiterchips (101) in einem Waferverbund (102) umfasst: - einen elektrisch leitfähigen Träger (103) zum Kontaktieren von Rückkontakten (104) der Halbleiterchips (101), - eine elektrisch leitfähige Folie (105) zum Kontaktieren von Vorderkontakten (106) der Halbleiterchips (101),die den Rückkontakte (104) gegenüberliegen, - eine Rakel (107), die relativ zu der Folie (105) verschiebbar ist und ausgebildet ist, einen Bereich (108)der Folie (105) in Richtung zum Träger (103) zu drücken.
(EN)
A device for processing a multiplicity of semiconductor chips (101) in a wafer assemblage (102) comprises: – an electrically conductive carrier (103) for contacting rear contacts (104) of the semiconductor chips (101), – an electrically conductive film (105) for contacting front contacts (106) of the semiconductor chips (101) that are situated opposite the rear contacts (104), – a squeegee (107), which is displaceable relative to the film (105) and is configured to press a region (108) of the film (105) in the direction toward the carrier (103).
(FR)
L'invention concerne un dispositif de traitement d'une pluralité de puces semi-conductrices (101) dans une tranche composite (102). Le dispositif comprend : un support (103) électriquement conducteur servant à établir un contact entre des contacts arrière (104) des puces semi-conductrices (101) ; un film (105) électriquement conducteur servant à établir un contact entre des contacts avant (106) des puces semi-conductrices (101), qui font face aux contacts arrière (104) ; une raclette (107), qui peut être coulissée par rapport au film (105) et qui est réalisée pour pousser une zone (108) du film (105) en direction du support (103).
Also published as
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