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1. WO2020069516 - POLYAMIC ACID RESIN IN REACH-APPROVED SOLVENT SYSTEM FOR WIRE COATING APPLICATIONS

Publication Number WO/2020/069516
Publication Date 02.04.2020
International Application No. PCT/US2019/053855
International Filing Date 30.09.2019
IPC
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C09D 5/08 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
08Anti-corrosive paints
C09D 7/20 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
20Diluents or solvents
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
C08G 73/1032
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
1003Preparatory processes
1007from tetracarboxylic acids or derivatives and diamines
1028characterised by the process itself, e.g. steps, continuous
1032characterised by the solvent(s) used
C08G 73/1071
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
C09D 179/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
179Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C09D 5/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced
08Anti-corrosive paints
C09D 7/20
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
20Diluents or solvents
H05K 1/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
Applicants
  • KANEKA AMERICAS HOLDING, INC. [US]/[US]
Inventors
  • MELONI, Paul
  • ZHENG, Haibin
Agents
  • MASON, J., Derek
  • MILLER, Marina, I.
  • ONOE, Yuki
Priority Data
62/738,10628.09.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) POLYAMIC ACID RESIN IN REACH-APPROVED SOLVENT SYSTEM FOR WIRE COATING APPLICATIONS
(FR) RÉSINE D'ACIDE POLYAMIQUE DANS UN SYSTÈME DE SOLVANTS APPROUVÉS PAR LE RÈGLEMENT REACH POUR DES APPLICATIONS DE REVÊTEMENT DE FIL
Abstract
(EN)
The present invention discloses a polyamic acid resin composition in a REACH-approved solvent system for use in wire coating applications. The polyamic acid resin composition comprises a molecular weight greater than 8,000 grams per mole, more preferably greater than 20,000 grams per mole. The REACH-approved solvent system comprising a primary REACHapproved solvent with one or more optional secondary REACH-approved co-solvents. The secondary REACH-approved co-solvent can be reactive or non-reactive with dianhydride. The present invention also discloses the elimination of solvents in polyamic acid resin to produce a REACH-approved polyamic acid resin powder.
(FR)
La présente invention concerne une composition de résine d'acide polyamique dans un système de solvants approuvés par le règlement REACH destiné à être utilisé dans des applications de revêtement de fil. La composition de résine d'acide polyamique comprend un poids moléculaire supérieur à 8 000 grammes par mole, plus préférablement supérieur à 20 000 grammes par mole. Le système de solvants approuvés par le règlement REACH comprend un solvant primaire approuvé par le règlement REACH avec un ou plusieurs co-solvants secondaires approuvés par le règlement REACH facultatifs. Le co-solvant secondaire approuvé le règlement REACH peut être réactif ou non réactif avec le dianhydride. La présente invention concerne également l'élimination de solvants dans une résine d'acide polyamique pour produire une poudre de résine d'acide polyamique approuvée par le règlement REACH.
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