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1. WO2020068427 - METHOD AND APPARATUS FOR DIRECT MEASUREMENT OF CHUCKING FORCE ON AN ELECTROSTATIC CHUCK

Publication Number WO/2020/068427
Publication Date 02.04.2020
International Application No. PCT/US2019/050629
International Filing Date 11.09.2019
IPC
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H02N 13/00 2006.01
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
13Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
B23Q 3/15 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL, CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
3Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine
15Devices for holding work using magnetic or electric force acting directly on the work
G01L 1/08 2006.01
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
1Measuring force or stress, in general
08by the use of counterbalancing forces
CPC
G01L 1/04
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
1Measuring force or stress, in general
04by measuring elastic deformation of gauges, e.g. of springs
G01L 1/16
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
1Measuring force or stress, in general
16using properties of piezo-electric devices
H01L 21/67253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67253Process monitoring, e.g. flow or thickness monitoring
H01L 21/6831
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6831using electrostatic chucks
H01L 21/6833
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6831using electrostatic chucks
6833Details of electrostatic chucks
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • POTTER, Charles, G.
  • BOYD, Wendell, Glenn Jr.
  • RAJ, Govinda
  • HIRAHARA, Robert
Agents
  • BERNADICOU, Michael, A.
  • BRASK, Justin, K.
Priority Data
16/566,40910.09.2019US
62/738,73728.09.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR DIRECT MEASUREMENT OF CHUCKING FORCE ON AN ELECTROSTATIC CHUCK
(FR) PROCÉDÉ ET APPAREIL DE MESURE DIRECTE DE FORCE DE SERRAGE SUR UN MANDRIN ÉLECTROSTATIQUE
Abstract
(EN)
Embodiments disclosed herein include a method of measuring the chucking force of an electrostatic chuck. In an embodiment, the method comprises placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors, and applying a chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck, and processing a plurality of wafers on the electrostatic chuck. In an embodiment, the method further comprises placing the sensor wafer onto the electrostatic chuck, and applying the chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a second chucking force profile of the electrostatic chuck.
(FR)
Selon des modes de réalisation, la présente invention concerne un procédé de mesure de la force de serrage d'un mandrin électrostatique. Dans un mode de réalisation, le procédé comprend le placement d'une tranche à capteurs sur le mandrin électrostatique, la tranche à capteurs comprenant une pluralité de capteurs de pression, et l'application d'une tension de serrage au mandrin électrostatique. Dans un mode de réalisation, le procédé comprend en outre la mesure de la force de serrage avec la pluralité de capteurs de pression pour déterminer un premier profil de force de serrage du mandrin électrostatique, et le traitement d'une pluralité de tranches sur le mandrin électrostatique. Dans un mode de réalisation, le procédé comprend en outre le placement de la tranche à capteurs sur le mandrin électrostatique, et l'application de la tension de serrage au mandrin électrostatique. Dans un mode de réalisation, le procédé comprend en outre la mesure de la force de serrage avec la pluralité de capteurs de pression pour déterminer un second profil de force de serrage du mandrin électrostatique.
Also published as
Latest bibliographic data on file with the International Bureau