Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020068224 - TWO-PHASE THERMODYNAMIC SYSTEM HAVING A POROUS MICROSTRUCTURE SHEET TO INCREASE AN AGGREGATE THIN-FILM EVAPORATION AREA OF A WORKING FLUID

Publication Number WO/2020/068224
Publication Date 02.04.2020
International Application No. PCT/US2019/039127
International Filing Date 26.06.2019
IPC
F28D 15/04 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
04with tubes having a capillary structure
H01L 23/427 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
CPC
F28D 15/0266
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0266with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
F28D 15/046
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
04with tubes having a capillary structure
046characterised by the material or the construction of the capillary structure
F28F 3/12
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
12Elements constructed in the shape of a hollow panel, e.g. with channels
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20381
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2029using a liquid coolant with phase change in electronic enclosures
20381Thermal management, e.g. evaporation control
Applicants
  • MICROSOFT TECHNOLOGY LICENSING, LLC [US]/[US]
Inventors
  • BEN-MENAHEM, Shahar
  • LIN, Tzu-Yuan
  • NIKKHOO, Michael
Agents
  • MINHAS, Sandip S.
  • CHEN, Wei-Chen Nicholas
  • HINOJOSA, Brianna L.
  • HOLMES, Danielle J.
  • SWAIN, Cassandra T.
  • WONG, Thomas S.
  • CHOI, Daniel
  • HWANG, William C.
  • WIGHT, Stephen A.
  • CHATTERJEE, Aaron C.
  • JARDINE, John S.
  • GOLDSMITH, Micah P.
Priority Data
16/147,41628.09.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) TWO-PHASE THERMODYNAMIC SYSTEM HAVING A POROUS MICROSTRUCTURE SHEET TO INCREASE AN AGGREGATE THIN-FILM EVAPORATION AREA OF A WORKING FLUID
(FR) SYSTÈME THERMODYNAMIQUE À DEUX PHASES PRÉSENTANT UNE FEUILLE À MICROSTRUCTURE POREUSE PERMETTANT D'AUGMENTER UNE ZONE D'ÉVAPORATION SOUS FILM MINCE D'AGRÉGAT D'UN FLUIDE DE TRAVAIL
Abstract
(EN)
A two-phase thermodynamic system includes a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid. The porous microstructure sheet may be disposed at a liquid-vapor boundary of the working fluid. The porous microstructure sheet has "micro" pores through which the working fluid flows from a liquid flow path on one side of the porous microstructure sheet to a vapor flow path on the other side of the porous microstructure sheet. Individual pores induce the working fluid to form thin-film evaporation regions. The porous microstructure sheet may have a pore density so as to increase an aggregate thin-film evaporation area of the working fluid. In this way, the overall thermal resistance across all liquid-vapor interfaces (menisci) of the working fluid is substantially decreased over conventional vapor chamber.
(FR)
L'invention concerne un système thermodynamique à deux phases incluant une feuille à microstructure poreuse destinée à augmenter une zone d'évaporation sous film mince d'agrégat d'un fluide de travail. La feuille à microstructure poreuse peut être disposée au niveau d'une limite liquide/vapeur du fluide de travail. La feuille à microstructure poreuse présente des "micro" pores à travers lesquels le fluide de travail s'écoule à partir d'un trajet d'écoulement de liquide sur un côté de la feuille à microstructure poreuse vers un trajet d'écoulement de vapeur sur l'autre côté de la feuille à microstructure poreuse. Des pores individuels amènent le fluide de travail à former des régions d'évaporation à film mince. La feuille à microstructure poreuse peut présenter une densité de pores de manière à augmenter une zone d'évaporation sous film mince d'agrégat du fluide de travail. De cette manière, la résistance thermique globale à travers toutes les interfaces liquide-vapeur (ménisque) du fluide de travail est sensiblement réduite par rapport à une chambre de vapeur classique.
Latest bibliographic data on file with the International Bureau