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1. WO2020067673 - POLYAMIDE/POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED PRODUCT USING SAME

Publication Number WO/2020/067673
Publication Date 02.04.2020
International Application No. PCT/KR2019/012069
International Filing Date 18.09.2019
IPC
C08L 71/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
08Polyethers derived from hydroxy compounds or from their metallic derivatives
10from phenols
12Polyphenylene oxides
C08L 77/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
C08L 77/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
02Polyamides derived from omega-amino carboxylic acids or from lactams thereof
C08K 3/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
02Elements
04Carbon
C08K 3/34 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
C08L 25/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02Homopolymers or copolymers of hydrocarbons
04Homopolymers or copolymers of styrene
08Copolymers of styrene
CPC
C08K 3/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
04Carbon
C08K 3/34
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
C08L 25/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02Homopolymers or copolymers of hydrocarbons
04Homopolymers or copolymers of styrene
08Copolymers of styrene
C08L 71/12
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71Compositions of polyethers obtained by reactions forming an ether link in the main chain
08Polyethers derived from hydroxy compounds or from their metallic derivatives
10from phenols ; not used
12Polyphenylene oxides
C08L 77/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
C08L 77/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
02Polyamides derived from omega-amino carboxylic acids or from lactams thereof
Applicants
  • 롯데케미칼 주식회사 LOTTE CHEMICAL CORPORATION [KR]/[KR]
Inventors
  • 최원영 CHOI, Wonyoung
  • 김세현 KIM, Sehyun
  • 반균하 BAN, Kyunha
  • 진영섭 JIN, Youngsub
Agents
  • 팬코리아특허법인 PANKOREA PATENT AND LAW FIRM
Priority Data
10-2018-011638528.09.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) POLYAMIDE/POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED PRODUCT USING SAME
(FR) COMPOSITION DE RÉSINE DE POLYAMIDE/ÉTHER DE POLYPHÉNYLÈNE ET PRODUIT MOULÉ L'UTILISANT
(KO) 폴리아미드/폴리페닐렌 에테르 수지 조성물 및 이를 이용한 성형품
Abstract
(EN)
The present invention relates to a polyamide/polyphenylene ether resin composition and a molded product using same, the polyamide/polyphenylene ether resin composition comprising, relative to 100 parts by weight of a base resin containing (A) 30-60 wt% of a polyphenylene ether resin, (B) 25-55 wt% of a polyamide 66 resin, and (C) 5-40 wt% of a long aliphatic chain-containing polyamide resin, (D) 2-6 parts by weight of an impact modifier, (E) 0.5-1 part by weight of a compatibilizer, and (F) 10-30 parts by weight of a plate-shaped filler, wherein the weight ratio (B:C) of the polyamide 66 resin (B) and the long aliphatic chain-containing polyamide resin (C) satisfies 1:1 to 8:1.
(FR)
La présente invention concerne une composition de résine de polyamide/éther de polyphénylène et un produit moulé l'utilisant, la composition de résine de polyamide/éther de polyphénylène comprenant, par rapport à 100 parties en poids d'une résine de base contenant (A) 30 à 60 % en poids d'une résine d'éther de polyphénylène, (B) 25 à 55 % en poids d'une résine de polyamide 66, et (C) 5 à 40 % en poids d'une résine de polyamide contenant une longue chaîne aliphatique, (D) 2 à 6 parties en poids d'un agent antichoc, (E) 0,5 à 1 partie en poids d'un agent de compatibilité, et (F) 10 à 30 parties en poids d'une charge en forme de plaque, le rapport en poids (B/C) de la résine de polyamide 66 (B) et de la résine de polyamide contenant une longue chaîne aliphatique (C) étant de 1/1 à 8/1.
(KO)
(A) 폴리페닐렌 에테르 수지 30 중량% 내지 60 중량%, (B) 폴리아미드 66 수지 25 중량% 내지 55 중량%, 및 (C) 지방족 장쇄(long aliphatic chain) 함유 폴리아미드 수지 5 중량% 내지 40 중량%을 포함하는 기초수지 100 중량부에 대하여, (D) 충격보강제 2 중량부 내지 6 중량부, (E) 상용화제 0.5 중량부 내지 1 중량부, 및 (F) 판상형 필러 10 중량부 내지 30 중량부를 포함하고, 상기 (B) 폴리아미드 66 수지와 상기 (C) 지방족 장쇄 함유 폴리아미드 수지의 중량비(B:C)가 1:1 내지 8:1을 만족하는 폴리아미드/폴리페닐렌 에테르 수지 조성물과, 이를 이용한 성형품에 관한 것이다.
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