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1. WO2020067364 - COMPOSITION FOR FORMING HEAT CONDUCTIVE MATERIALS, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, DEVICE WITH HEAT CONDUCTIVE LAYER, AND FILM

Publication Number WO/2020/067364
Publication Date 02.04.2020
International Application No. PCT/JP2019/038007
International Filing Date 26.09.2019
IPC
C08G 59/62 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
62Alcohols or phenols
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08K 3/38 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
C08K 9/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
04Ingredients treated with organic substances
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C09K 5/14 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08Materials not undergoing a change of physical state when used
14Solid materials, e.g. powdery or granular
CPC
C08G 59/62
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
62Alcohols or phenols
C08J 5/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08K 3/38
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
C08K 9/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
9Use of pretreated ingredients
04Ingredients treated with organic substances
C08L 63/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C09K 5/14
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08Materials not undergoing a change of physical state when used
14Solid materials, e.g. powdery or granular
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 人見 誠一 HITOMI Seiichi
  • 高橋 慶太 TAKAHASHI Keita
  • 新居 輝樹 NIORI Teruki
  • 林 大介 HAYASHI Daisuke
Agents
  • 伊東 秀明 ITOH Hideaki
  • 三橋 史生 MITSUHASHI Fumio
Priority Data
2018-18554128.09.2018JP
2018-21140009.11.2018JP
2018-21140509.11.2018JP
2018-21150709.11.2018JP
2018-21164409.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPOSITION FOR FORMING HEAT CONDUCTIVE MATERIALS, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, DEVICE WITH HEAT CONDUCTIVE LAYER, AND FILM
(FR) COMPOSITION POUR FORMER DES MATÉRIAUX THERMOCONDUCTEURS, MATÉRIAU THERMOCONDUCTEUR, FEUILLE THERMOCONDUCTRICE, DISPOSITIF AVEC COUCHE THERMOCONDUCTRICE, ET FILM
(JA) 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス、膜
Abstract
(EN)
The present invention provides a composition for forming heat conductive materials, which enables the achievement of a heat conductive material that exhibits excellent heat conductivity. The present invention also provides: a heat conductive material which is formed from this composition for forming heat conductive materials; a heat conductive sheet; and a device with a heat conductive layer. The present invention additionally provides a film which enables the production of a heat conductive sheet that exhibits excellent heat conductivity. The present invention also provides: a heat conductive sheet which is formed of this film; and a device with a heat conductive layer. A composition for forming heat conductive materials according to the present invention contains: an epoxy compound; one or more phenolic compounds selected from the group consisting of compounds represented by general formula (1) and compounds represented by general formula (2); and an inorganic substance.
(FR)
La présente invention concerne une composition pour former des matériaux thermoconducteurs, qui permet l'obtention d'un matériau thermoconducteur qui présente une excellente conductivité thermique. La présente invention concerne également : un matériau thermoconducteur qui est formé à partir de cette composition pour former des matériaux thermoconducteurs ; une feuille thermoconductrice ; et un dispositif ayant une couche conductrice de chaleur. La présente invention concerne en outre un film qui permet la production d'une feuille thermoconductrice qui présente une excellente conductivité thermique. La présente invention concerne également : une feuille thermoconductrice qui est formée de ce film ; et un dispositif ayant une couche thermoconductrice. Une composition pour former des matériaux thermoconducteurs selon la présente invention contient : un composé époxy ; un ou plusieurs composés phénoliques sélectionnés dans le groupe constitué par les composés représentés par la formule générale (1) et les composés représentés par la formule générale (2) ; et une substance inorganique.
(JA)
本発明は、熱伝導性に優れた熱伝導材料を与え得る熱伝導材料形成用組成物を提供する。また、上熱伝導材料形成用組成物により形成される熱伝導材料、熱伝導シート、及び、熱伝導層付きデバイスを提供する。更に、本発明は、熱伝導性に優れた熱伝導シートを作製できる膜を提供する。また、上記膜により作製される熱伝導シート、及び、熱伝導層付きデバイスを提供する。本発明の熱伝導材料形成用組成物は、エポキシ化合物と、一般式(1)で表される化合物、及び、一般式(2)で表される化合物からなる群から選ばれる1種以上のフェノール化合物と、無機物と、を含む、熱伝導材料形成用組成物等である。
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