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1. WO2020067307 - LEAD-FREE SOLDER ALLOY

Publication Number WO/2020/067307
Publication Date 02.04.2020
International Application No. PCT/JP2019/037903
International Filing Date 26.09.2019
IPC
B23K 35/26 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400°C
C22C 13/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
C22C 13/02 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
02with antimony or bismuth as the next major constituent
CPC
B23K 35/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
C22C 13/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
C22C 13/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
02with antimony or bismuth as the next major constituent
Applicants
  • 株式会社日本スペリア社 NIHON SUPERIOR CO., LTD. [JP]/[JP]
Inventors
  • 西村 哲郎 NISHIMURA Tetsuro
  • 西村 貴利 NISHIMURA Takatoshi
  • 赤岩 徹哉 AKAIWA Tetsuya
  • 末永 将一 SUENAGA Shoichi
Agents
  • 柳野 隆生 YANAGINO Takao
  • 柳野 嘉秀 YANAGINO Yoshihide
  • 森岡 則夫 MORIOKA Norio
  • 関口 久由 SEKIGUCHI Hisayoshi
  • 中川 正人 NAKAGAWA Masato
Priority Data
2018-18104526.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LEAD-FREE SOLDER ALLOY
(FR) ALLIAGE DE SOUDAGE SANS PLOMB
(JA) 鉛フリーはんだ合金
Abstract
(EN)
This lead-free solder alloy exhibits extremely favorable creep characteristics as a result of the added quantity of Cu being 0.1-2.0 mass%, the added quantity of Ni being 0.01-1.0 mass% and the added quantity of Ge being 0.001-2.0 mass%, with the remainder comprising Sn and unavoidable impurities, and enables a synergistic improvement in weld strength by adding, in the aforementioned composition, 0.1-5.0 mass% of Bi and/or Sb in place of Sn. This lead-free solder alloy may contain 0.1-8.0 mass% of Bi and/or 0.1-6.5 mass% of Sb. In addition, the ratio (Ge/Cu) of the content of Ge relative to that of Cu may be 0.005-0.5. In addition, the lead-free solder alloy may contain 0.1-8.0 mass% of Bi and 0.1-6.5 mass% of Sb, and the ratio (Bi/Sb) of the content of Bi relative to that of Sb may be 0.02-50.
(FR)
L’invention concerne un alliage de soudage sans plomb qui présente des caractéristiques de fluage extrêmement favorables en raison de la quantité ajoutée de Cu allant de 0,1 à 2,0 % en masse, de la quantité ajoutée de Ni allant de 0,01 à 1,0 % en masse et de la quantité ajoutée de Ge allant de 0,001 à 2,0 % en masse, le reste comportant du Sn et des impuretés inévitables, et qui permet une amélioration synergique de la résistance de la soudure par l'ajout, dans la composition susmentionnée, de 0,1 à 5,0 % en masse de Bi et/ou de Sb à la place du Sn. Cet alliage de soudage sans plomb peut contenir de 0,1 à 8,0 % en masse de Bi et de 0,1 à 6,5 % en masse de Sb. De plus, le rapport (Ge/Cu) de la teneur en Ge par rapport à la teneur en Cu peut être compris entre 0,005 et 0,5. Par ailleurs, l’alliage de soudage sans plomb peut contenir de 0,1 à 8,0 % en masse de Bi et de 0,1 à 6,5 % en masse de Sb, et le rapport (Bi/Sb) de la teneur en Bi par rapport à la teneur en Sb peut être compris entre 0,02 et 50.
(JA)
本発明の鉛フリーはんだ合金は、Cuの添加量が0.1~2.0質量%、Niの添加量が0.01~1.0質量%、Geの添加量が0.001~2.0質量%であり、残部をSn及び不可避不純物を含有したことにより、極めて優れたクリープ特性を有し、更に、前述の組成にBi及び/又はSbの少なくとも1種をSnに替えて0.1~5.0質量%添加することにより、相乗的に接合強度の向上を有することを可能とした。前記鉛フリーはんだ合金は、Bi0.1~8.0質量%及び/又はSb0.1~6.5質量%を含有してもよい。また、Cuに対するGeの含有量の比率(Ge/Cu)が0.005~0.5であってもよい。また、Bi0.1~8.0質量%及びSb0.1~6.5質量%を含有し、かつSbに対するBiの含有量の比率(Bi/Sb)が0.02~50であってもよい。
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