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1. WO2020067238 - AGGREGATE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Publication Number WO/2020/067238
Publication Date 02.04.2020
International Application No. PCT/JP2019/037756
International Filing Date 26.09.2019
IPC
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H01F 17/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
17Fixed inductances of the signal type
H01F 41/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
41Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
02for manufacturing cores, coils or magnets
04for manufacturing coils
H01Q 1/38 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
36Structural form of radiating elements, e.g. cone, spiral, umbrella
38formed by a conductive layer on an insulating support
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/16 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
CPC
H01F 17/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
17Fixed inductances of the signal type
H01F 41/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
41Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
02for manufacturing cores, coils, or magnets
04for manufacturing coils
H01Q 1/38
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
36Structural form of radiating elements, e.g. cone, spiral, umbrella; ; Particular materials used therewith
38formed by a conductive layer on an insulating support
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/16
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 3/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 奥田 哲聡 OKUDA Noriaki
  • 藤村 有生 FUJIMURA Yu
  • 古村 知大 FURUMURA Tomohiro
  • 大菅 健聖 OSUGA Takeshi
  • 小栗 慎也 OGURI Shinya
  • 枝川 祐介 EDAGAWA Yusuke
Agents
  • 特許業務法人 楓国際特許事務所 KAEDE PATENT ATTORNEYS' OFFICE
Priority Data
2018-18314228.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) AGGREGATE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
(FR) SUBSTRAT AGRÉGÉ ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) 集合基板及びその製造方法
Abstract
(EN)
An aggregate substrate (101) is provided with: a plurality of element parts (PP11) and the like each having an electric function; and connection parts (CP) which are respectively connected to the plurality of element parts (PP11) and the like and which have no electric functions, wherein the element parts and the connection parts are arrayed in order. The element parts (PP11) and the like include: body parts (BP); first small-numbered laminate parts (LP1) in which the number of laminates of insulating resin substrates is less than in the body parts (BP); and second small-numbered laminate parts (LP2) in which the number of laminates of the insulating resin substrates is even less than in the first small-numbered laminate parts (LP1). The first low-numbered laminate parts (LP1) are each connected to the corresponding body part (BP), and the second low-numbered laminate parts (LP2) are each connected in between the corresponding first small-numbered laminate part (LP1) and the corresponding connection part (CP). The number of laminates of the insulating resin substrates in the connection parts (CP) is the same as the number of laminates of the insulating resin substrates in the second low-numbered laminate parts (LP2).
(FR)
L'invention concerne un substrat agrégé (101) pourvu : d'une pluralité de parties élémentaires (PP11) et analogues, ayant chacune une fonction électrique ; et de parties de liaison (CP) qui sont respectivement reliées à la pluralité de parties élémentaires (PP11) et similaires et qui n'ont pas de fonctions électriques, les parties élémentaires et les parties de liaison étant agencées en réseau. Les parties élémentaires (PP11) et similaires comprennent : des parties de corps (BP) ; des premières parties de stratifié (LP1) en petit nombre, le nombre de stratifiés de substrats de résine isolante étant inférieur à celui des parties de corps (BP) ; et des secondes parties de stratifié (LP2) en petit nombre, le nombre de stratifiés des substrats de résine isolante étant encore inférieur à celui des premières parties de stratifié (LP1) en petit nombre. Les premières parties de stratifié (LP1) en nombre limité sont chacune reliées à la partie de corps correspondante (BP), et les secondes parties de stratifié (LP2) en nombre limité sont chacune reliées entre la première partie stratifiée (LP1) en petit nombre correspondante et la partie de liaison correspondante (CP). Le nombre de stratifiés des substrats de résine isolante dans les parties de liaison (CP) est le même que le nombre de stratifiés des substrats de résine isolante dans les secondes parties de stratifié (LP2) en nombre limité.
(JA)
集合基板(101)は、それぞれ電気的機能を有する複数の素子部(PP11)等と、複数の素子部(PP11)等に連接する、電気的機能を有しない連接部(CP)と、を備え、素子部及び連接部が規則配列される。素子部(PP11)等は、本体部(BP)と、当該本体部(BP)に比べて絶縁性樹脂基材の積層数の少ない第1少数積層部(LP1)と、第1少数積層部(LP1)に比べて絶縁性樹脂基材の積層数が更に少ない第2少数積層部(LP2)とを有し、第1少数積層部(LP1)は本体部(BP)につながり、第2少数積層部(LP2)は第1少数積層部(LP1)と連接部(CP)との間につながり、連接部(CP)の絶縁性樹脂基材の積層数は第2少数積層部(LP2)の絶縁性樹脂基材の積層数と同じである。
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