Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020067222 - JOINING AND SEPARATION METHOD FOR ADHERENDS

Publication Number WO/2020/067222
Publication Date 02.04.2020
International Application No. PCT/JP2019/037720
International Filing Date 25.09.2019
IPC
C09J 5/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/38 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 5/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/38
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives [PSA]
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 粟根 諒 AWANE Ryo
  • 平尾 昭 HIRAO Akira
  • 赤松 香織 AKAMATSU Kaori
  • 溝端 香 MIZOBATA Kaori
Agents
  • 特許業務法人栄光特許事務所 EIKOH PATENT FIRM, P.C.
Priority Data
2018-18463528.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) JOINING AND SEPARATION METHOD FOR ADHERENDS
(FR) PROCÉDÉ DE JONCTION ET DE SÉPARATION POUR PARTIES ADHÉRÉES
(JA) 被着体の接合・分離方法
Abstract
(EN)
The present invention pertains to a bonding and separation method for adherends, including: a first bonding step in which an adhesive sheet including at least an adhesive layer containing an electrolyte is bonded to a first adherend; a first voltage application step in which, in a state in which the adhesive layer containing the electrolyte is joined to the first adherend, voltage is applied to the adhesive layer containing the electrolyte such that a potential difference is generated in the thickness direction of the adhesive layer containing the electrolyte; a first separation step in which the adhesive sheet and the first adherend are separated; and a second bonding step in which the adhesive sheet separated from the first adherend in the first separation step is bonded to a second adherend.
(FR)
La présente invention concerne un procédé de jonction et de séparation pour parties adhérées, comprenant : une première étape de jonction dans laquelle une feuille adhésive comprenant au moins une couche adhésive contenant un électrolyte est liée à une première partie adhérée ; une première étape d’application de tension dans laquelle, dans un état dans lequel la couche adhésive contenant l’électrolyte est jointe à la première partie adhérée, une tension est appliquée à la couche adhésive contenant l’électrolyte de sorte qu’une différence de potentiel est générée dans le sens de l’épaisseur de la couche adhésive contenant l’électrolyte ; une première étape de séparation dans laquelle la feuille adhésive et la première partie adhérée sont séparées ; et une seconde étape de jonction dans laquelle la feuille adhésive séparée de la première partie adhérée dans la première étape de séparation est liée à une seconde partie adhérée.
(JA)
本発明は、電解質を含有する粘着剤層を少なくとも含む粘着シートを、第1の被着体と接合する第1の接合工程と、前記電解質を含有する粘着剤層が前記第1の被着体と接合された状態で、前記電解質を含有する粘着剤層の厚さ方向に電位差を生じるように前記電解質を含有する粘着剤層に電圧を印加する第1の電圧印加工程と、前記粘着シートと前記第1の被着体とを分離する第1の分離工程と、前記第1の分離工程において、前記第1の被着体と分離された前記粘着シートを、第2の被着体と接合する第2の接合工程とを含む被着体の接合・分離方法に関する。
Also published as
Latest bibliographic data on file with the International Bureau