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1. WO2020067221 - ADHEREND SEPARATION METHOD AND JOINING METHOD

Publication Number WO/2020/067221
Publication Date 02.04.2020
International Application No. PCT/JP2019/037719
International Filing Date 25.09.2019
IPC
C09J 7/38 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
C09J 5/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 5/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/38
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives [PSA]
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 粟根 諒 AWANE Ryo
  • 平尾 昭 HIRAO Akira
  • 赤松 香織 AKAMATSU Kaori
  • 溝端 香 MIZOBATA Kaori
Agents
  • 特許業務法人栄光特許事務所 EIKOH PATENT FIRM, P.C.
Priority Data
2018-18456528.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHEREND SEPARATION METHOD AND JOINING METHOD
(FR) PROCÉDÉ DE SÉPARATION DE PARTIE À COLLER ET PROCÉDÉ D'ASSEMBLAGE
(JA) 被着体の分離方法及び接合方法
Abstract
(EN)
The present invention pertains to an adherend separation method having: a first voltage application step in which, in a state in which an electrolyte-containing adhesive layer in an adhesive sheet including at least the adhesive layer containing the electrolyte is joined to an adherend, voltage is applied to the adhesive layer containing the electrolyte such that a potential difference is generated in the thickness direction of the adhesive layer containing the electrolyte, and the adhesion is changed; a bond maintenance step in which, after the first voltage application step and in a state in which the adhesive layer containing the electrolyte is joined to the adherend, a prescribed time elapses and the adhesive force is recovered; a second voltage application step in which, after the bond maintenance step and in a state in which the adhesive layer containing the electrolyte is joined to the adherend, a voltage is applied to the adhesive layer containing the electrolyte such that a potential difference is generated in the thickness direction of the adhesive layer containing the electrolyte and the adhesive force is changed; and a separation step in which the adhesive layer containing the electrolyte and the adherend are separated.
(FR)
La présente invention concerne un procédé de séparation de partie à coller comprenant : une première étape d'application de tension dans laquelle, dans un état dans lequel une couche adhésive contenant un électrolyte dans une feuille adhésive comprenant au moins la couche adhésive contenant l'électrolyte est jointe à une partie à coller, une tension est appliquée à la couche adhésive contenant l'électrolyte de telle sorte qu'une différence de potentiel est générée dans le sens de l'épaisseur de la couche adhésive contenant l'électrolyte, et l'adhérence est modifiée ; une étape de maintien de liaison dans laquelle, après la première étape d'application de tension et dans un état dans lequel la couche adhésive contenant l'électrolyte est jointe à la partie à coller, un délai prescrit s'écoule et la force adhésive est récupérée ; une seconde étape d'application de tension dans laquelle, après l'étape de maintien de liaison et dans un état dans lequel la couche adhésive contenant l'électrolyte est jointe à la partie à coller, une tension est appliquée à la couche adhésive contenant l'électrolyte de telle sorte qu'une différence de potentiel est générée dans le sens de l'épaisseur de la couche adhésive contenant l'électrolyte et la force adhésive est modifiée ; et une étape de séparation dans laquelle la couche adhésive contenant l'électrolyte et la partie à coller sont séparées.
(JA)
本発明は、電解質を含有する粘着剤層を少なくとも含む粘着シートにおける前記電解質を含有する粘着剤層が被着体と接合された状態で、前記電解質を含有する粘着剤層の厚さ方向に電位差を生じるように前記電解質を含有する粘着剤層に電圧を印加し粘着力を変化させる第1の電圧印加工程と、前記第1の電圧印加工程の後、前記電解質を含有する粘着剤層が前記被着体と接合された状態で所定時間経過させ粘着力を回復させる接合維持工程と、前記接合維持工程の後、前記電解質を含有する粘着剤層が前記被着体と接合された状態で、前記電解質を含有する粘着剤層の厚さ方向に電位差を生じるように前記電解質を含有する粘着剤層に電圧を印加し粘着力を変化させる第2の電圧印加工程と、前記電解質を含有する粘着剤層と前記被着体とを分離する分離工程と、を有する被着体の分離方法に関する。
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