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1. WO2020067191 - ULTRASONIC BONDING METHOD

Publication Number WO/2020/067191
Publication Date 02.04.2020
International Application No. PCT/JP2019/037659
International Filing Date 25.09.2019
IPC
B23K 20/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10making use of vibrations, e.g. ultrasonic welding
B29C 65/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
02by heating, with or without pressure
08using ultrasonic vibrations
CPC
B23K 20/10
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10making use of vibrations, e.g. ultrasonic welding
B29C 65/08
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining ; or sealing; of preformed parts ; , e.g. welding of plastics materials; Apparatus therefor
02by heating, with or without pressure
08using ultrasonic vibrations
Applicants
  • 株式会社LINK-US LINK-US CO., LTD. [JP]/[JP]
Inventors
  • 光行 潤 MITSUYUKI Jun
Agents
  • 特許業務法人創成国際特許事務所 SATO & ASSOCIATES
Priority Data
2018-18535528.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ULTRASONIC BONDING METHOD
(FR) PROCÉDÉ DE SOUDAGE PAR ULTRA-SONS
(JA) 超音波接合方法
Abstract
(EN)
Provided is an ultrasonic bonding method with which bonding quality can be improved. This ultrasonic bonding method is provided with: a pressure application step for applying pressure to a plurality of workpieces W via a horn tip, and a bonding step for vibrating the horn tip by means of ultrasonic vibration in which a vibration component in a first direction and a vibration component in a first direction are combined, thereby bonding the plurality of workpieces W. In the bonding step the vibration amplitude of the horn tip and one or both of the pressure (static pressure) applied to the plurality of workpieces and the amount of displacement after the horn tip makes contact with the workpieces are changed such that one is linked with the other.
(FR)
La présente invention concerne un procédé de soudage par ultra-sons grâce auquel la qualité du soudage peut être améliorée. Ce procédé de soudage par ultra-sons comprend une étape d'application de pression consistant à appliquer une pression sur une pluralité de pièces W par l'intermédiaire d'une pointe de sonotrode, et une étape de soudage consistant à faire vibrer la pointe de sonotrode au moyen d'une vibration ultrasonore dans laquelle une composante de vibration dans une première direction et une composante de vibration dans une première direction sont combinées, ce qui permet de souder la pluralité de pièces W.Dans l'étape de soudage, l'amplitude de vibration de la pointe de sonotrode ainsi que la pression (pression statique) appliquée sur la pluralité de pièces et/ou la quantité de déplacement après que la pointe de sonotrode entre en contact avec les pièces sont modifiées de sorte que l’une est liée à l'autre.
(JA)
接合品質を向上させることができる超音波接合方法を提供する。本発明の超音波接合方法は、ホーンチップを介して複数のワークに圧力を加えて加圧する加圧工程と、第1方向の振動成分と第1方向の振動成分とを複合させた超音波振動によってホーンチップを振動させ、複数のワークWを接合する接合工程とを備えている。接合工程において、複数のワークに加える圧力(静圧力)及びホーンチップのワークに当接してからの変位量の少なくとも一方と、ホーンチップの振動振幅は、一方が他方に連動するように変化する。
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