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1. WO2020066998 - POLISHING LIQUID, CONCENTRATE OF SAME, METHOD FOR PRODUCING POLISHED ARTICLE USING POLISHING LIQUID, AND POLISHING METHOD OF SUBSTRATE USING POLISHING LIQUID

Publication Number WO/2020/066998
Publication Date 02.04.2020
International Application No. PCT/JP2019/037239
International Filing Date 24.09.2019
IPC
C09K 3/14 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
B24B 37/00 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
C03C 19/00 2006.01
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
19Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
C09G 1/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
GPOLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1Polishing compositions
02containing abrasives or grinding agents
CPC
B24B 37/00
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
C03C 19/00
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
19Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
C09G 1/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
GPOLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1Polishing compositions
02containing abrasives or grinding agents
C09K 3/14
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
Applicants
  • 株式会社バイコウスキージャパン BAIKOWSKI JAPAN CO., LTD. [JP]/[JP]
  • 株式会社ディスコ DISCO CORPORATION [JP]/[JP]
Inventors
  • 細井 大祐 HOSOI, Daisuke
  • 久保田 直樹 KUBOTA, Naoki
  • 繁田 岳志 SHIGETA, Takashi
  • 井上 雄貴 INOUE, Yuki
  • 鈴木 孝雅 Suzuki, Takamasa
Agents
  • 特許業務法人翔和国際特許事務所 SHOWA INTERNATIONAL PATENT FIRM
Priority Data
2018-18082226.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLISHING LIQUID, CONCENTRATE OF SAME, METHOD FOR PRODUCING POLISHED ARTICLE USING POLISHING LIQUID, AND POLISHING METHOD OF SUBSTRATE USING POLISHING LIQUID
(FR) LIQUIDE DE POLISSAGE, CONCENTRÉ DE CELUI-CI, PROCÉDÉ DE PRODUCTION D'UN ARTICLE POLI À L'AIDE D'UN LIQUIDE DE POLISSAGE, ET PROCÉDÉ DE POLISSAGE DE SUBSTRAT FAISANT APPEL À UN LIQUIDE DE POLISSAGE
(JA) 研磨液、その濃縮液、研磨液を用いる研磨処理物品の製造方法及び研磨液を用いる基板の研磨方法
Abstract
(EN)
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The average particle diameter D50 of the ceria abrasive grains is from 120 nm to 550 nm (inclusive). The average particle diameter D50 of the silica abrasive grains is from 40 nm to 140 nm (inclusive). The mass ratio of the silica abrasive grains to the ceria abrasive grains in the polishing liquid, namely the value of (silica abrasive grains)/(ceria abrasive grains) is from 4/100 to 150/100 (inclusive). The content of the ceria abrasive grains in the polishing liquid is from 0.25% by mass to 2.5% by mass (inclusive). The content of the silica abrasive grains in the polishing liquid is from 0.1% by mass to 1.5% by mass (inclusive).
(FR)
Ce liquide de polissage est utilisé pour polir un substrat siliceux qui a une rugosité de surface Ra comprise entre 0,01 µm et 0,2 µm (inclus). Ce liquide de polissage contient des grains abrasifs d'oxyde de cérium, des grains abrasifs d'oxyde de silicium et de l'eau. Le diamètre particulaire moyen D50 des grains abrasifs d'oxyde de cérium est compris entre 120 nm et 550 nm (valeurs extrêmes incluses). Le diamètre particulaire moyen D50 des grains abrasifs d'oxyde de silicium est compris entre 40 nm et 140 nm (valeurs extrêmes incluses). Le rapport en masse des grains abrasifs d'oxyde de silicium aux grains abrasifs d'oxyde de cérium dans le liquide de polissage, à savoir la valeur de (grains abrasifs d'oxyde de silicium)/ (grains abrasifs d'oxyde de cérium) est de 4/100 à 150/100 (inclus). La teneur en grains abrasifs d'oxyde de cérium dans le liquide de polissage se situe entre 0,25% en masse et 2,5% en masse (inclus). La teneur en grains abrasifs d'oxyde de silicium dans le liquide de polissage se situe entre 0,1% en masse et 1,5% en masse (inclus).
(JA)
本発明の研磨液は、表面粗さRaが0.01μm以上0.2μm以下のシリカ質基板を研磨するために用いられる。研磨液は、セリア砥粒と、シリカ砥粒と、水とを含む。セリア砥粒の平均粒径D50は120nm以上550nm以下である。記シリカ砥粒の平均粒径D50は40nm以上140nm以下である。研磨液中のセリア砥粒に対するシリカ砥粒の質量比であるシリカ砥粒/セリア砥粒の値が4/100以上150/100以下である。研磨液中のセリア砥粒の含有量は0.25質量%以上2.5質量%以下である。研磨液中のシリカ砥粒の含有量は0.1質量%以上1.5質量%以下である。
Also published as
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