Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020066978 - CURABLE COMPOSITION FOR IMPRINTING, METHOD FOR PRODUCING CURABLE COMPOSITION FOR IMPRINTING, CURED ARTICLE, METHOD FOR PRODUCING PATTERN AND METHOD FOR PRODUCING SEMICONDUCTOR

Publication Number WO/2020/066978
Publication Date 02.04.2020
International Application No. PCT/JP2019/037190
International Filing Date 24.09.2019
IPC
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B29C 59/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping, e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
C08F 2/48 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
46Polymerisation initiated by wave energy or particle radiation
48by ultra-violet or visible light
CPC
B29C 59/02
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping ; of articles; , e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
C08F 2/48
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
46Polymerisation initiated by wave energy or particle radiation
48by ultra-violet or visible light
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 後藤 雄一郎 GOTO Yuichiro
  • 下重 直也 SHIMOJU Naoya
Agents
  • 特許業務法人特許事務所サイクス SIKs & Co.
Priority Data
2018-18511628.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE COMPOSITION FOR IMPRINTING, METHOD FOR PRODUCING CURABLE COMPOSITION FOR IMPRINTING, CURED ARTICLE, METHOD FOR PRODUCING PATTERN AND METHOD FOR PRODUCING SEMICONDUCTOR
(FR) COMPOSITION DURCISSABLE POUR IMPRESSION, PROCÉDÉ DE PRODUCTION D'UNE COMPOSITION DURCISSABLE POUR IMPRESSION, ARTICLE DURCI, PROCÉDÉ DE PRODUCTION DE MOTIF ET PROCÉDÉ DE PRODUCTION DE SEMI-CONDUCTEUR
(JA) インプリント用硬化性組成物、インプリント用硬化性組成物の製造方法、硬化物、パターン製造方法および半導体素子の製造方法
Abstract
(EN)
Provided is a curable composition for imprinting which contains a polymerizable compound, a photopolymerization initiator, and a particulate metal which includes one or more types of iron, copper, titanium and lead and exhibits a particle diameter of at least 1nm when measured according to the single particle ICP-MASS method, wherein the particulate metal content is 100 mass ppt to 30 mass ppb of the solid content of the composition. Further provided are a method for producing the curable composition for imprinting, a cured article which uses the curable composition for imprinting, a method for producing a pattern and a method for producing a semiconductor.
(FR)
L'invention concerne une composition durcissable pour impression qui contient un composé polymérisable, un initiateur de photopolymérisation et un métal particulaire qui comprend un ou plusieurs types de fer, de cuivre, de titane et de plomb et présente un diamètre de particule d'au moins 1 nm lorsqu'il est mesuré selon le procédé ICP-MASS à particule unique, la teneur en métal particulaire étant de 100 ppt en masse à 30 ppb en masse du contenu solide de la composition. L'invention concerne en outre un procédé de production de la composition durcissable pour impression, un article durci qui utilise la composition durcissable pour impression, un procédé de production d'un motif et un procédé de production d'un semi-conducteur.
(JA)
重合性化合物と、光重合開始剤と、Single Particle ICP-MASS法により測定される粒子径が1nm以上であり、かつ、鉄、銅、チタンおよび鉛の少なくとも1種を含む粒子性メタルとを含むインプリント用硬化性組成物であって、粒子性メタルの含有量が、組成物の固形分の100質量ppt~30質量ppbである、インプリント用硬化性組成物、ならびに、上記インプリント用硬化性組成物の製造方法、上記インプリント用硬化性組成物を用いた硬化物、パターン製造方法および半導体素子の製造方法。
Latest bibliographic data on file with the International Bureau