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1. WO2020066975 - RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE

Publication Number WO/2020/066975
Publication Date 02.04.2020
International Application No. PCT/JP2019/037187
International Filing Date 24.09.2019
IPC
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08F 299/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02from unsaturated polycondensates
C08L 79/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
G03F 7/037 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
CPC
C08F 299/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02from unsaturated polycondensates
C08G 73/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
G03F 7/037
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 小川 倫弘 OGAWA Michihiro
  • 岩井 悠 IWAI Yu
Agents
  • 特許業務法人特許事務所サイクス SIKs & Co.
Priority Data
2018-18163627.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE, FILM DURCI, STRATIFIÉ, PROCÉDÉ DE PRODUCTION DE FILM DURCI ET DISPOSITIF À SEMI-CONDUCTEUR
(JA) 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス
Abstract
(EN)
This resin composition contains at least one polymer precursor selected from polyimide precursors and polybenzoxazole precursors, wherein the total content of HNO2, NO2-, HNO3, NO3-, H2SO4, HSO4-, SO42-, H2SO3, HSO3-, and SO32- with respect to the total solid content of the resin composition is not less than 1 mass ppb but not more than 1000 mass ppm. The cured film, the laminate, the cured film production method, and the semiconductor device according to the present invention all use said resin composition.
(FR)
La composition de résine selon la présente invention contient au moins un précurseur de polymère choisi parmi des précurseurs de polyimide et des précurseurs de polybenzoxazole, la teneur totale de HNO2, NO2 -, HNO3, NO3 -, H2SO4, HSO4 -, SO4 2-, H2SO3, HSO3 - et SO3 2- par rapport à la teneur totale en solides de la composition de résine n'étant pas inférieure à 1 ppb en masse et étant inférieure ou égale à 1000 ppm en masse. Le film durci, le stratifié, le procédé de production de film durci et le dispositif à semi-conducteur selon la présente invention utilisent tous ladite composition de résine.
(JA)
ポリイミド前駆体およびポリベンザオキサゾール前駆体から選ばれる少なくとも1種のポリマー前駆体を含む樹脂組成物であって、HNO2、NO2-、HNO3、NO3-、H2SO4、HSO4-、SO42-、H2SO3、HSO3-およびSO32-の合計の含有量が樹脂組成物の全固形分に対して1質量ppb以上1000質量ppm以下である樹脂組成物。樹脂組成物を用いた硬化膜、積層体、硬化膜の製造方法、および半導体デバイス。
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