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1. WO2020066589 - METHOD FOR MANUFACTURING WAFER PLACEMENT STAND

Publication Number WO/2020/066589
Publication Date 02.04.2020
International Application No. PCT/JP2019/035481
International Filing Date 10.09.2019
IPC
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
B28B 11/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
11Apparatus or processes for treating or working the shaped articles
C04B 35/624 2006.01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
624Sol-gel processing
C04B 35/645 2006.01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
64Burning or sintering processes
645Pressure sintering
CPC
B28B 11/00
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
11Apparatus or processes for treating or working the shaped ; or preshaped; articles
C04B 35/624
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
35Shaped ceramic products characterised by their composition
622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
624Sol-gel processing
C04B 35/645
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
35Shaped ceramic products characterised by their composition
622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
64Burning or sintering processes
645Pressure sintering
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
Applicants
  • 日本碍子株式会社 NGK INSULATORS, LTD. [JP]/[JP]
Inventors
  • ▲のぼり▼ 和宏 NOBORI, Kazuhiro
  • 木村 拓二 KIMURA, Takuji
Agents
  • 特許業務法人アイテック国際特許事務所 ITEC INTERNATIONAL PATENT FIRM
Priority Data
2018-18117427.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR MANUFACTURING WAFER PLACEMENT STAND
(FR) PROCÉDÉ DE FABRICATION D'UN SUPPORT DE PLACEMENT DE TRANCHE
(JA) ウエハ載置台の製法
Abstract
(EN)
A method for manufacturing a wafer placement stand of the present embodiment includes: (a) a step in which a reticulated portion 22a of a metal mesh 22 is filled with a ceramic slurry that includes ceramic powder and a gelling agent, and the ceramic slurry is gelled due to chemical reaction of the gelling agent, then is degreased and calcinated to manufacture a ceramic-filled mesh 20; (b) a step in which the ceramic-filled mesh 20 is sandwiched between a first ceramic calcinated body 31 and a second ceramic calcinated body 32 which are obtained by mold-cast molding followed by calcination, to produce a layered body 40; and (c) a step in which the layered body 40 is hot-press fired to produce a wafer placement stand 10.
(FR)
Un mode de réalisation de la présente invention concerne un procédé de fabrication d'un support de placement de tranche comprenant : (a) une étape dans laquelle une partie réticulée 22a d'un maillage métallique 22 est remplie d'une bouillie céramique qui comprend une poudre céramique et un agent gélifiant, et la bouille céramique est gélifiée en raison de la réaction chimique de l'agent gélifiant, puis est dégraissée et calcinée pour fabriquer un maillage rempli de céramique 20 ; (b) une étape dans laquelle le maillage rempli de céramique 20 est pris en sandwich entre un premier corps calciné en céramique 31 et un second corps calciné en céramique 32 qui sont obtenus par moulage coulé en moule suivi d'une calcination, pour produire un corps stratifié 40 ; et (c) une étape dans laquelle le corps stratifié 40 est cuit à chaud pour produire un support de placement de tranche 10.
(JA)
本実施形態のウエハ載置台の製法は、(a)セラミック粉末とゲル化剤とを含むセラミックスラリーを金属メッシュ22の網目部分22aに充填し、ゲル化剤を化学反応させてセラミックスラリーをゲル化させた後、脱脂、仮焼することによりセラミック充填メッシュ20を作製する工程と、(b)モールドキャスト成形したあと仮焼して得られた第1セラミック仮焼体31と第2セラミック仮焼体32との間にセラミック充填メッシュ20を挟み込むことにより積層体40を作製する工程と、(c)積層体40をホットプレス焼成することによりウエハ載置台10を作製する工程と、を含む。
Also published as
Latest bibliographic data on file with the International Bureau