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1. WO2020066489 - SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

Publication Number WO/2020/066489
Publication Date 02.04.2020
International Application No. PCT/JP2019/034542
International Filing Date 03.09.2019
IPC
B23K 35/363 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
362Selection of compositions of fluxes
363for soldering or brazing
B23K 35/26 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400°C
C22C 13/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
CPC
B23K 35/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
C22C 13/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
Applicants
  • 株式会社タムラ製作所 TAMURA CORPORATION [JP]/[JP]
Inventors
  • 榮西 弘 EINISHI Hiro
  • 臼倉 伸一 USUKURA Shinichi
  • 吉澤 慎二 YOSHIZAWA Shinji
  • 岩渕 充 IWABUCHI Mitsuru
Agents
  • 特許業務法人樹之下知的財産事務所 KINOSHITA & ASSOCIATES
Priority Data
2018-18246127.09.2018JP
2019-15958202.09.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
(FR) COMPOSITION DE BRASURE ET SUBSTRAT ÉLECTRONIQUE
(JA) はんだ組成物および電子基板
Abstract
(EN)
A solder composition according to the present invention is characterized by comprising: a flux composition containing (A) a rosin resin, (B) an activator, and (C) a solvent; and (D) a solder powder having a melting point of 200-250°C, wherein the (B) component contains at least one substance selected from the group consisting of (B1) aromatic carboxylic acids having a hydroxy group only at the ortho position or the pros position, (B2) dicarboxylic acids having an alkylene group and having 2-8 carbon atoms, and (B3) monocarboxylic acids having an alkyl group and having 2-8 carbon atoms, and the component (C) contains (C1) a diol or a diol diacetate having a boiling point of 220–250°C.
(FR)
La présente invention porte sur une composition de brasure qui comprend (A) une résine de colophane, (B) un activateur et (C) une composition de flux contenant un solvant, et (D) une poudre de brasure ayant un point de fusion compris entre 200 et 250 °C, le composant (B) contenant au moins un élément choisi dans le groupe constitué par (B1) des acides carboxyliques aromatiques ayant un groupe hydroxy uniquement à la position ortho ou à la position pros, (B2) des acides dicarboxyliques ayant un groupe alkylène et ayant entre 2 et 8 atomes de carbone, et (B3) des acides monocarboxyliques ayant un groupe alkyle et ayant entre 2 et 8 atomes de carbone, et le composant (C) contenant (C1) un diol ou un diacétate de diol ayant un point d'ébullition compris entre 220 et 250 °C.
(JA)
本発明のはんだ組成物は、(A)ロジン系樹脂、(B)活性剤および(C)溶剤を含有するフラックス組成物と、(D)融点が200℃以上250℃以下であるはんだ粉末とを含有し、前記(B)成分が、(B1)オルト位またはプロス位のみに水酸基を有する芳香族カルボン酸、(B2)アルキレン基を有し、炭素数が2~8のジカルボン酸、および、(B3)アルキル基を有し、炭素数が2~8のモノカルボン酸からなる群から選択される少なくとも1種を含有し、前記(C)成分が、(C1)沸点が220℃以上250℃以下である、ジオール、または、ジオールのジアセテートを含有することを特徴とするものである。
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