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1. WO2020066442 - IMPRINTING UNDERLAYER FILM FORMING COMPOSITION, UNDERLAYER FILM, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

Publication Number WO/2020/066442
Publication Date 02.04.2020
International Application No. PCT/JP2019/033723
International Filing Date 28.08.2019
IPC
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B29C 59/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping, e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
C08F 290/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
08on to polymers modified by introduction of unsaturated side groups
12Polymers provided for in subclasses C08C or C08F76
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
CPC
B29C 59/02
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping ; of articles; , e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
C08F 290/12
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
08on to polymers modified by introduction of unsaturated side groups
12Polymers provided for in subclasses C08C or C08F
C08L 101/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 袴田 旺弘 HAKAMATA Akihiro
  • 後藤 雄一郎 GOTO Yuichiro
  • 下重 直也 SHIMOJU Naoya
Agents
  • 特許業務法人特許事務所サイクス SIKs & Co.
Priority Data
2018-18234727.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) IMPRINTING UNDERLAYER FILM FORMING COMPOSITION, UNDERLAYER FILM, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
(FR) COMPOSITION DE FORMATION DE FILM DE SOUS-COUCHE D'IMPRESSION, FILM DE SOUS-COUCHE, PROCÉDÉ DE FORMATION DE MOTIF ET PROCÉDÉ DE FABRICATION D'ÉLÉMENT SEMI-CONDUCTEUR
(JA) インプリント用下層膜形成用組成物、下層膜、パターン形成方法および半導体素子の製造方法
Abstract
(EN)
With the purpose of improving adhesiveness between a substrate and a cured product, an imprinting underlayer film forming composition is applied to an imprinting process, the composition comprising: a polymer; a low molecular weight compound which is selected from an acid having a pKa of 5 or less and an acid generating agent capable of generating an acid having a pKa of 5 or less, which has a functional group that can bond to the polymer, and which has a molecular weight of 1000 or less; and a solvent.
(FR)
Dans le but d'améliorer l'adhésivité entre un substrat et un produit durci, une composition de formation de film de sous-couche d'impression est appliquée à un processus d'impression, la composition comprenant : un polymère ; un composé de faible poids moléculaire qui est choisi parmi un acide ayant un pKa inférieur ou égal à 5 et un agent de génération d'acide capable de générer un acide ayant un pKa inférieur ou égal à 5, qui a un groupe fonctionnel qui peut se lier au polymère, et qui a un poids moléculaire inférieur ou égal à 1000 ; et un solvant.
(JA)
基板と硬化物との接着性を向上させることを目的として、重合体と、pKaが5以下の酸およびpKa5以下の酸を発生可能な酸発生剤から選択され、かつ、上記重合体と結合可能な官能基を有し、かつ、分子量が1000以下である低分子化合物と、溶剤とを含む、インプリント用下層膜形成用組成物を、インプリントプロセスに適用した。
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