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1. WO2020066405 - STACKED BODY, STACKED BODY MANUFACTURING METHOD, AND CAPACITIVE INPUT DEVICE

Publication Number WO/2020/066405
Publication Date 02.04.2020
International Application No. PCT/JP2019/033197
International Filing Date 26.08.2019
IPC
B32B 27/18 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
18characterised by the use of special additives
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/031 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/02967
G06F 3/041 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
CPC
B32B 27/00
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
B32B 27/18
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
18characterised by the use of special additives
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/031
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/029
G06F 3/041
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 霜山 達也 SHIMOYAMA Tatsuya
  • 小川 恭平 OGAWA Kyohei
Agents
  • 中島 順子 NAKASHIMA Junko
  • 米倉 潤造 YONEKURA Junzo
  • 藤森 義真 FUJIMORI Yoshinao
Priority Data
2018-18573128.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) STACKED BODY, STACKED BODY MANUFACTURING METHOD, AND CAPACITIVE INPUT DEVICE
(FR) CORPS EMPILÉ, PROCÉDÉ DE FABRICATION DE CORPS EMPILÉ ET DISPOSITIF D'ENTRÉE CAPACITIF
(JA) 積層体、積層体の製造方法、及び静電容量型入力装置
Abstract
(EN)
Provided are a stacked body having excellent adhesion between an oxide particle-containing layer and a resin layer over a base material, a stacked body manufacturing method, and a capacitive input device. The stacked body comprises: a base material; an oxide particle-containing layer including at least one type of metal oxide particles selected from the group consisting of titanium oxide particles and zirconium oxide particles; and a resin layer which is a cured product of a photosensitive composition disposed on a surface of the oxide particle-containing layer, and which has an internal stress of less than or equal to 1.0 MPa, wherein a crosslinking density of an ethylenic unsaturated group in a first upper-layer portion including a surface in contact with the oxide particle-containing layer is equal to or more than 1.2 mmol/g. The stacked body manufacturing method comprises a step of forming a photosensitive layer and a step of forming a resin layer.
(FR)
La présente invention concerne un corps empilé ayant une excellente adhérence entre une couche contenant des particules d'oxyde et une couche de résine sur un matériau de base, un procédé de fabrication de corps empilé et un dispositif d'entrée capacitif. Le corps empilé comprend : un matériau de base ; une couche contenant des particules d'oxyde comprenant au moins un type de particules d'oxyde métallique choisies dans le groupe constitué de particules d'oxyde de titane et de particules d'oxyde de zirconium ; et une couche de résine qui est un produit durci d'une composition photosensible disposée sur une surface de la couche contenant des particules d'oxyde, et qui a une contrainte interne inférieure ou égale à 1,0 MPa, une densité de réticulation d'un groupe insaturé éthylénique dans une première partie couche supérieure comprenant une surface en contact avec la couche contenant des particules d'oxyde étant supérieure ou égale à 1,2 mmol/g. Le procédé de fabrication de corps empilé comprend une étape de formation d'une couche photosensible et une étape de formation d'une couche de résine.
(JA)
基材上の酸化物粒子含有層と樹脂層との密着性に優れた積層体、積層体の製造方法、及び静電容量型入力装置を提供する。積層体は、基材と、酸化チタン粒子及び酸化ジルコニウム粒子からなる群より選ばれる少なくとも一種の金属酸化物粒子を含む酸化物粒子含有層と、酸化物粒子含有層の表面に設けられた感光性組成物の硬化物であって、内部応力が1.0MPa以下であり、かつ、酸化物粒子含有層と接する表面を含む第1の表層部におけるエチレン性不飽和基の架橋密度が1.2mmol/g以上である樹脂層と、を有する。積層体の製造方法は、感光性層を形成する工程と、樹脂層を形成する工程と、を有する
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