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1. WO2020066380 - CIRCUIT MODULE AND COMMUNICATION DEVICE

Publication Number WO/2020/066380
Publication Date 02.04.2020
International Application No. PCT/JP2019/032720
International Filing Date 21.08.2019
IPC
H01L 25/04 2014.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 25/10 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10the devices having separate containers
H01L 25/11 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10the devices having separate containers
11the devices being of a type provided for in group H01L29/78
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H03H 9/17 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
15Constructional features of resonators consisting of piezo-electric or electrostrictive material
17having a single resonator
CPC
H01L 23/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 25/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
H01L 25/10
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
10the devices having separate containers
H01L 25/11
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
10the devices having separate containers
11the devices being of a type provided for in group H01L29/00
H01L 25/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
H03H 9/17
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
15Constructional features of resonators consisting of piezo-electric or electrostrictive material
17having a single resonator
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 相川 清志 AIKAWA, Kiyoshi
  • 楠山 貴文 KUSUYAMA, Takafumi
Agents
  • 吉川 修一 YOSHIKAWA, Shuichi
  • 傍島 正朗 SOBAJIMA, Masaaki
Priority Data
2018-18358128.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT MODULE AND COMMUNICATION DEVICE
(FR) MODULE DE CIRCUIT ET DISPOSITIF DE COMMUNICATION
(JA) 回路モジュール及び通信装置
Abstract
(EN)
This circuit module (100) is provided with: a wiring board (110) having a main surface (111); and a plurality of components (120) that are mounted on the main surface (111). The plurality of components (120) include a laminated component (130) that is made into a single chip by being molded with a resin member (137a and 137b), and the laminated component (130) has: a wiring board (131) having main surfaces (132 and 133) that are disposed opposite to each other; a component (134) mounted on the main surface (132); and a component (135) mounted on the main surface (133).
(FR)
L'invention concerne un module de circuit (100) comportant : une carte de câblage (110) ayant une surface principale (111) ; et une pluralité de composants (120) qui sont montés sur la surface principale (111). La pluralité de composants (120) comprend un composant stratifié (130) qui est réalisé en une seule puce en étant moulé avec un élément en résine (137a 137b), et le composant stratifié (130) comprend : une carte de câblage (131) ayant des surfaces principales (132 et 133) qui sont disposées à l'opposé les unes des autres ; un composant (134) monté sur la surface principale (132) ; et un composant (135) monté sur la surface principale (133).
(JA)
回路モジュール(100)は、主面(111)を有する配線基板(110)と、主面(111)に実装された複数の部品(120)と、を備え、複数の部品(120)は、樹脂部材(137a及び137b)によりモールドされることで1チップ化された積層部品(130)を含み、積層部品(130)は、互いに対向する主面(132及び133)を有する配線基板(131)と、主面(132)に実装された部品(134)と、主面(133)に実装された部品(135)と、を有する。
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