Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020066244 - PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, PRODUCTION METHOD FOR CURED FILM, SEMICONDUCTOR DEVICE, AND THERMAL BASE GENERATOR

Publication Number WO/2020/066244
Publication Date 02.04.2020
International Application No. PCT/JP2019/028671
International Filing Date 22.07.2019
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
C08F 290/14 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
08on to polymers modified by introduction of unsaturated side groups
14Polymers provided for in subclass C08G52
G03F 7/027 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
CPC
C08F 290/14
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
08on to polymers modified by introduction of unsaturated side groups
14Polymers provided for in subclass C08G
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 野崎 敦靖 NOZAKI Atsuyasu
Agents
  • 中島 順子 NAKASHIMA Junko
  • 米倉 潤造 YONEKURA Junzo
  • 藤森 義真 FUJIMORI Yoshinao
Priority Data
2018-18101626.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, PRODUCTION METHOD FOR CURED FILM, SEMICONDUCTOR DEVICE, AND THERMAL BASE GENERATOR
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM DURCI, PRODUIT STRATIFIÉ, PROCÉDÉ DE PRODUCTION DE FILM DURCI, DISPOSITIF À SEMI-CONDUCTEUR ET GÉNÉRATEUR DE BASE THERMIQUE
(JA) 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、および熱塩基発生剤
Abstract
(EN)
Provided is a photosensitive resin composition having excellent curability and storage stability. Also, provided are: a cured film employing the photosensitive resin composition; a layered product; a production method for a cured film; and a semiconductor device. This photosensitive resin composition comprises a thermal base generator represented by formula (N1), and at least one precursor compound of polyimide precursors and polybenzoxazole precursors. In formula (N1), XN represents one of a hydroxy group, a carboxyl group, and a sulfonate group, ZN represents an oxygen atom or a sulfur atom, LN represents a hydrocarbon group linking together adjacent nitrogen atoms and XN, and the number of atoms constituting the linking chain is 2-6.
(FR)
L'invention concerne une composition de résine photosensible ayant une excellente aptitude au durcissement et une excellente stabilité au stockage. L'invention concerne également : un film durci utilisant la composition de résine photosensible ; un produit stratifié ; un procédé de production d'un film durci ; et un dispositif à semi-conducteur. Cette composition de résine photosensible comprend un générateur de base thermique représenté par la formule (N1) ainsi qu'au moins un composé précurseur parmi les précurseurs de polyimide et les précurseurs de polybenzoxazole. Dans la formule (N1), XN représente un groupe hydroxy, un groupe carboxyle et un groupe sulfonate, ZN représente un atome d'oxygène ou un atome de soufre, LN représente un groupe hydrocarboné liant entre eux des atomes d'azote adjacents et XN, et le nombre d'atomes constituant la chaîne de liaison est de 2 à 6.
(JA)
硬化性および保存安定性に優れた感光性樹脂組成物を提供する。また、上記感光性樹脂組成物を利用した硬化膜、積層体、硬化膜の製造方法および半導体デバイスを提供する。感光性樹脂組成物は、式(N1)で表される熱塩基発生剤と、ポリイミド前駆体およびポリベンゾオキサゾール前駆体の少なくとも1種の前駆体化合物とを含む。式(N1)において、XNは、水酸基、カルボキシル基およびスルホン酸基のいずれか1種を表し、ZNは酸素原子または硫黄原子を表し、LNは、隣接する窒素原子からXNまでを連結する炭化水素基であって、連結鎖を構成する原子の数が2~6である炭化水素基を表す。
Latest bibliographic data on file with the International Bureau