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1. WO2020066146 - LOW DIELECTRIC SUBSTRATE

Publication Number WO/2020/066146
Publication Date 02.04.2020
International Application No. PCT/JP2019/023076
International Filing Date 11.06.2019
IPC
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
B32B 5/18 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5Layered products characterised by the non-homogeneity or physical structure of a layer
18characterised by features of a layer containing foamed or specifically porous material
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is next to another layer of the same or of a different material
08of synthetic resin
B32B 5/18
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5Layered products characterised by the non- homogeneity or physical structure ; , i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
18characterised by features of a layer ; of; foamed material
H05K 3/28
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 中村 将義 NAKAMURA, Masayoshi
  • 松富 亮人 MATSUTOMI, Akihito
  • 三島 慧 MISHIMA, Kei
Agents
  • 岡本 寛之 OKAMOTO, Hiroyuki
  • 宇田 新一 UDA, Shinichi
Priority Data
2018-18458128.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOW DIELECTRIC SUBSTRATE
(FR) SUBSTRAT À FAIBLE CONSTANTE DIÉLECTRIQUE
(JA) 低誘電基板材
Abstract
(EN)
This low dielectric substrate comprises, in order in the direction of thickness, a porous resin layer and a metal layer, and further comprises a protective material disposed on one surface of either the porous resin layer or the metal layer. The Shore D hardness H1 at 23°C of the protective material and the Shore D hardness H2 at 23°C of the porous resin layer satisfy formula (1), or thickness T1 of the protective material and thickness T0 of the laminated material comprising the porous resin layer and metal layer satisfy formula (2). Formula (1): H1 < H2 Formula (2): T1 > 0.5 x T0
(FR)
L'invention porte sur un substrat à faible constante diélectrique qui comprend, dans l'ordre, dans le sens de l'épaisseur, une couche de résine poreuse et une couche métallique, et qui comporte en outre un matériau protecteur disposé sur une surface de la couche de résine poreuse ou de la couche métallique. La dureté Shore D H1 à 23 °C du matériau protecteur et la dureté Shore D H2 à 23 °C de la couche de résine poreuse satisfont la formule (1), ou l'épaisseur T1 du matériau protecteur et l'épaisseur T0 du matériau stratifié comprenant la couche de résine poreuse et la couche métallique satisfont la formule (2). Formule (1) : H1 < H2 Formule (2) : T1 > 0,5 x T0
(JA)
低誘電基板材は、多孔質樹脂層および金属層を厚み方向に順に備え、多孔質樹脂層および金属層のいずれか一方の表面に配置される保護材をさらに備え、保護材の23℃のショアD硬度H1と、多孔質樹脂層の23℃のショアD硬度H2とが、下記式(1)を満足し、または、保護材の厚みT1と、多孔質樹脂層および金属層を備える積層材の厚みT0とが、下記式(2)を満足する。 H1<H2 (1) T1>0.5×T0 (2)
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Latest bibliographic data on file with the International Bureau