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1. WO2020066145 - LOW DIELECTRIC SUBSTRATE MATERIAL

Publication Number WO/2020/066145
Publication Date 02.04.2020
International Application No. PCT/JP2019/023075
International Filing Date 11.06.2019
IPC
H05K 3/38 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
B32B 5/18 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5Layered products characterised by the non-homogeneity or physical structure of a layer
18characterised by features of a layer containing foamed or specifically porous material
B32B 7/025 2019.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
02Physical, chemical or physicochemical properties
025Electric or magnetic properties
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
B32B 5/18
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5Layered products characterised by the non- homogeneity or physical structure ; , i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
18characterised by features of a layer ; of; foamed material
B32B 7/025
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
02Physical, chemical or physicochemical properties
025Electric or magnetic properties
H05K 1/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/38
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 松富 亮人 MATSUTOMI, Akihito
  • 中村 将義 NAKAMURA, Masayoshi
  • 三島 慧 MISHIMA, Kei
Agents
  • 岡本 寛之 OKAMOTO, Hiroyuki
  • 宇田 新一 UDA, Shinichi
Priority Data
2018-18394828.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOW DIELECTRIC SUBSTRATE MATERIAL
(FR) MATÉRIAU DE SUBSTRAT À FAIBLE CONSTANTE DIÉLECTRIQUE
(JA) 低誘電基板材
Abstract
(EN)
This low dielectric substrate material comprises, in the following order in the thickness direction, a porous resin layer, ah adhesive layer, and a metal layer. The thickness d1 of the adhesive layer and the thickness d2 of the porous resin layer satisfy formula (1). d1/d2≤0.5 (1)
(FR)
L'invention concerne un matériau de substrat à faible constante diélectrique comprenant, dans l'ordre suivant dans le sens de l'épaisseur, une couche de résine poreuse, une couche adhésive et une couche métallique. L'épaisseur d1 de la couche adhésive et l'épaisseur d2 de la couche de résine poreuse satisfont la formule (1). d1/d2≤0,5 (1)
(JA)
低誘電基板材は、多孔質樹脂層と、接着層と、金属層とを厚み方向に順に備える。接着層の厚みd1と、多孔質樹脂層の厚みd2とが、下記式(1)を満足する。 d1/d2≦0.5 (1)
Also published as
Latest bibliographic data on file with the International Bureau