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1. WO2020066085 - PLANAR-TYPE WIRELESS POWER-RECEIVING CIRCUIT MODULE

Publication Number WO/2020/066085
Publication Date 02.04.2020
International Application No. PCT/JP2019/015722
International Filing Date 11.04.2019
IPC
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01F 38/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
38Adaptations of transformers or inductances for specific applications or functions
14Inductive couplings
H01L 23/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H02J 50/10 2016.01
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
50Circuit arrangements or systems for wireless supply or distribution of electric power
10using inductive coupling
CPC
H01F 38/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
38Adaptations of transformers or inductances for specific applications or functions
14Inductive couplings
H01L 23/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H02J 50/10
HELECTRICITY
02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
50Circuit arrangements or systems for wireless supply or distribution of electric power
10using inductive coupling
H02J 50/70
HELECTRICITY
02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
50Circuit arrangements or systems for wireless supply or distribution of electric power
70involving the reduction of electric, magnetic or electromagnetic leakage fields
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 貝和 航陽 KAIWA Koyo
  • 細谷 達也 HOSOTANI Tatsuya
Agents
  • 特許業務法人 楓国際特許事務所 KAEDE PATENT ATTORNEYS' OFFICE
Priority Data
2018-17881025.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PLANAR-TYPE WIRELESS POWER-RECEIVING CIRCUIT MODULE
(FR) MODULE DE CIRCUIT DE RÉCEPTION D'ÉNERGIE SANS FIL DE TYPE PLAN
(JA) 平面型ワイヤレス受電回路モジュール
Abstract
(EN)
A planar-type wireless power-receiving circuit module (101) is provided with: a planar ground conductor (51); a substrate (21); a power-receiving coil (30); and a magnetic sheet (41). The planar ground conductor (51) has an opening (H) provided at the center thereof. The substrate (21) is disposed on a first major surface (MS51A) of the planar ground conductor (51), and has a plurality of dielectric layers stacked thereon, forming a circuit. The power-receiving coil (30) is connected to the circuit, and is disposed in the opening (H). The magnetic sheet (41) overlaps the power-receiving coil (30) in a plan view of the planar ground conductor (51), constitutes a part of the magnetic path of a magnetic flux linked with the power-receiving coil (30), and is disposed on a first major surface (MS30A) of the power-receiving coil (30).
(FR)
L'invention concerne un module de circuit de réception d'énergie sans fil de type plan (101) comprenant : un conducteur de masse plan (51) ; un substrat (21) ; une bobine de réception d'énergie (30) ; et une feuille magnétique (41). Le conducteur de masse plan (51) a une ouverture (H) formée au centre de celui-ci. Le substrat (21) est disposé sur une première surface principale (MS51A) du conducteur de masse plan (51), et comporte une pluralité de couches diélectriques empilées sur celui-ci, formant un circuit. La bobine de réception d'énergie (30) est connectée au circuit, et est disposée dans l'ouverture (H). La feuille magnétique (41) chevauche la bobine de réception d'énergie (30) dans une vue en plan du conducteur de masse plan (51), constitue une partie du trajet magnétique d'un flux magnétique relié à la bobine de réception d'énergie (30), et est disposée sur une première surface principale (MS30A) de la bobine de réception d'énergie (30).
(JA)
平面型ワイヤレス受電回路モジュール(101)は、平面グランド導体(51)と、基体(21)と、受電コイル(30)と、磁性シート(41)と、を備える。平面グランド導体(51)の中央には開口(H)が設けられていて、基体(21)は、平面グランド導体(51)の第1主面(MS51A)に配置されていて、複数の誘電体層が積層されて回路が構成されている。受電コイル(30)は、回路に接続され、開口(H)の内部に配置されている。磁性シート(41)は、平面グランド導体(51)の平面視で受電コイル(30)に重なり、受電コイル(30)に鎖交する磁束の磁路の一部を構成し、受電コイル(30)の第1主面(MS30A)に配置される。
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