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1. WO2020066049 - CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, LAMINATED STRUCTURE, AND ELECTRONIC COMPONENT

Publication Number WO/2020/066049
Publication Date 02.04.2020
International Application No. PCT/JP2019/002807
International Filing Date 28.01.2019
IPC
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
B32B 27/18 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
18characterised by the use of special additives
C08K 9/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
02Ingredients treated with inorganic substances
C08K 9/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
04Ingredients treated with organic substances
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/038 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
CPC
B32B 27/18
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
18characterised by the use of special additives
C08K 9/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
9Use of pretreated ingredients
02Ingredients treated with inorganic substances
C08K 9/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
9Use of pretreated ingredients
04Ingredients treated with organic substances
C08L 101/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/038
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
Applicants
  • 太陽インキ製造株式会社 TAIYO INK MFG. CO., LTD. [JP]/[JP]
Inventors
  • 植田 千穂 UETA Chiho
  • 工藤 知哉 KUDO Tomoya
  • 嶋田 沙和子 SHIMADA Sawako
  • 岡田 和也 OKADA Kazuya
Agents
  • 本多 一郎 HONDA Ichiro
Priority Data
2018-18606628.09.2018JP
2018-18606728.09.2018JP
2018-18606828.09.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, LAMINATED STRUCTURE, AND ELECTRONIC COMPONENT
(FR) COMPOSITION DE RÉSINE DURCISSABLE, FEUIL SEC, PRODUIT DURCI, STRUCTURE STRATIFIÉE ET COMPOSANT ÉLECTRONIQUE
(JA) 硬化性樹脂組成物、ドライフィルム、硬化物、積層構造体、および、電子部品
Abstract
(EN)
Provided is a curable resin composition or the like from which it is possible to obtain a cured product that can improve dispersibility of a perovskite-type compound, that has excellent adhesion to a substrate, and that can achieve a high dielectric constant and a low dielectric loss tangent simultaneously. This curable resin composition or the like is characterized by including a curable resin and a perovskite-type compound that is coated with at least one of a hydrous oxide of silicon, a hydrous oxide of aluminum, a hydrous oxide of zirconium, a hydrous oxide of zinc, and a hydrous oxide of titanium.
(FR)
L’invention concerne une composition de résine durcissable et similaire, laquelle permet d’obtenir un produit durci permettant de combiner une constante diélectrique élevée et un faible facteur de dissipation diélectrique, excellent en terme d'adhérence au substrat, et pouvant améliorer la dispersibilité d'un composé de type pérovskite. Cette composition de résine durcissable se caractérise en ce qu’elle contient: un composé de type pérovskite recouvert par au moins un oxyde hydraté choisi parmi un oxyde hydraté de silicium, un oxyde hydraté d’aluminium, un oxyde hydraté de zirconium, un oxyde hydraté de zinc, et un oxyde hydraté de titane; et une résine durcissable.
(JA)
ペロブスカイト型化合物の分散性が向上し、基板との密着性に優れ、高誘電率と低誘電正接を両立することができる硬化物が得られる硬化性樹脂組成物等を提供する。ケイ素の水和酸化物、アルミニウムの水和酸化物、ジルコニウムの水和酸化物、亜鉛の水和酸化物およびチタンの水和酸化物のうちの少なくともいずれか1種により被覆されたペロブスカイト型化合物と、硬化性樹脂と、を含むことを特徴とする硬化性樹脂組成物等である。
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