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1. WO2020065910 - METHOD FOR MANUFACTURING DISPLAY DEVICE

Publication Number WO/2020/065910
Publication Date 02.04.2020
International Application No. PCT/JP2018/036221
International Filing Date 28.09.2018
IPC
G09F 9/00 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/50 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H05B 33/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
H05B 33/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements
CPC
G09F 9/00
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 51/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
H05B 33/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
H05B 33/04
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements ; , e.g. against humidity
Applicants
  • シャープ株式会社 SHARP KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 河邑 寛樹 KAWAMURA, Hiroki
  • 塩田 素二 SHIOTA, Motoji
  • 青田 圭司 AOTA, Keiji
Agents
  • 特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR MANUFACTURING DISPLAY DEVICE
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIF D'AFFICHAGE
(JA) 表示装置の製造方法
Abstract
(EN)
A method for manufacturing a display device (2) according to the present invention comprises: a bending step of bending a bend section (b1) on a TFT layer (4) at the position of a film slit (10a) formed in a support material (10) that is bonded to the surface of the TFT layer (4) on the opposite side from the light-emitting element layer (5) side surface, so that the support material (10) is on the inside with a spacer (30) being sandwiched by the support material (10); and a coating step of applying a resin (31) to the region between the spacer (30) and the film slit (10a).
(FR)
La présente invention concerne un procédé de fabrication d'un dispositif d'affichage (2) comprenant : une étape de pliage consistant à plier une section de courbure (b1) sur une couche de TFT (4) au niveau de la position d'une fente de film (10a) formée dans un matériau de support (10) qui est lié à la surface de la couche de TFT (4) sur le côté opposé à la surface latérale (5) de la couche d'élément électroluminescent, de telle sorte que le matériau de support (10) se trouve sur l'intérieur, un élément d'espacement (30) étant pris en sandwich par le matériau de support (10) ; et une étape de revêtement consistant à appliquer une résine (31) sur la région entre l'élément d'espacement (30) et la fente de film (10a).
(JA)
本発明に係る表示装置(2)の製造方法は、TFT層(4)において発光素子層(5)側の面の反対側の面に貼り付けられた支持材(10)に形成されたフィルムスリット(10a)の位置で、支持材(10)が内側になるように折り曲げ部(b1)を折り曲げ、支持材(10)間にスペーサ(30)を挟み込む折り曲げ工程と、スペーサ(30)とフィルムスリット(10a)との間に樹脂(31)を塗布する塗布工程とを包含する。
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