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1. WO2020065860 - PHOTOSENSITIVE RESIN COMPOSITION, PATTERN CURED FILM AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE

Publication Number WO/2020/065860
Publication Date 02.04.2020
International Application No. PCT/JP2018/036063
International Filing Date 27.09.2018
IPC
G03F 7/023 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
022Quinonediazides
023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
C08L 33/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Compositions of derivatives of such polymers
C08L 61/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
04Condensation polymers of aldehydes or ketones with phenols only
H01L 21/312 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
312Organic layers, e.g. photoresist
CPC
C08L 33/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
C08L 61/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61Compositions of condensation polymers of aldehydes or ketones
04Condensation polymers of aldehydes or ketones with phenols only
G03F 7/023
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
022Quinonediazides
023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Applicants
  • 日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP]/[JP]
Inventors
  • 木村 美華 KIMURA Mika
  • 濱野 芳美 HAMANO Yoshimi
  • 青木 優 AOKI Yu
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 清水 義憲 SHIMIZU Yoshinori
  • 平野 裕之 HIRANO Hiroyuki
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION, PATTERN CURED FILM AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM DURCI À MOTIF ET SON PROCÉDÉ DE FABRICATION, ÉLÉMENT SEMI-CONDUCTEUR ET DISPOSITIF ÉLECTRONIQUE
(JA) 感光性樹脂組成物、パターン硬化膜及びその製造方法、半導体素子、並びに電子デバイス
Abstract
(EN)
Disclosed is a photosensitive resin composition including: an alkali-soluble resin; a compound that generates an acid using light; a thermal crosslinking agent; and an elastomer, wherein the alkali-soluble resin includes a resin that has an alicyclic ring.
(FR)
L'invention concerne une composition de résine photosensible comprenant : une résine soluble dans les alcalis; un composé qui génère un acide à l'aide de lumière; un agent de réticulation thermique; et un élastomère, la résine soluble dans les alcalis comprenant une résine qui a un anneau alicyclique.
(JA)
アルカリ可溶性樹脂と、光によって酸を生成する化合物と、熱架橋剤と、エラストマと、を含有し、アルカリ可溶性樹脂が、脂環式環を有する樹脂を含む、感光性樹脂組成物が開示される。
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