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1. WO2020065765 - HEATING DEVICE

Publication Number WO/2020/065765
Publication Date 02.04.2020
International Application No. PCT/JP2018/035690
International Filing Date 26.09.2018
IPC
B29C 35/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
02Heating or curing, e.g. crosslinking or vulcanising
H01L 21/324 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
CPC
B29C 35/02
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
02Heating or curing, e.g. crosslinking or vulcanizing ; during moulding, e.g. in a mould
H01L 21/324
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Applicants
  • シャープ株式会社 SHARP KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 藤原 正樹 FUJIWARA, Masaki
Agents
  • 特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEATING DEVICE
(FR) DISPOSITIF DE CHAUFFAGE
(JA) 加熱装置
Abstract
(EN)
A heating device (40) according to the present invention is provided with: a chamber (41) in which a mixture (12a) is fired; an introduction pipe (60A) which is connected to the chamber (41) and introduces N2 into the chamber (41); and a discharge pipe (70A) which is connected to the chamber (41) and discharges a gas from the chamber (41). The discharge pipe (70A) is provided so as to surround the introduction pipe (60A). Consequently, the present invention provides a heating device which is prevented from increase in the power consumption.
(FR)
L’invention concerne un dispositif de chauffage (40) comprenant : une chambre (41) dans laquelle un mélange (12a) est cuit ; un tuyau d'introduction (60A) qui est relié à la chambre (41) et introduit N2 dans la chambre (41) ; et un tuyau d'évacuation (70A) qui est relié à la chambre (41) et évacue un gaz de la chambre (41). Le tuyau d'évacuation (70A) est disposé de façon à entourer le tuyau d'introduction (60A). Par conséquent, la présente invention concerne un dispositif de chauffage empêchant l'augmentation de la consommation d'énergie.
(JA)
加熱装置(40)は、混合物(12a)を焼成処理するチャンバー(41)と、チャンバー(41)と接続されチャンバー(41)内にNを導入する導入管(60A)と、チャンバー(41)と接続されチャンバー(41)内の気体を排出する排気管(70A)とを備え、排気管(70A)は、導入管(60A)を囲むように設けられている。これにより、消費電力の増大を防止した加熱装置を提供する。
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