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1. WO2020065499 - THERMALLY CONDUCTIVE SHEET PRECURSOR, THERMALLY CONDUCTIVE SHEET OBTAINED FROM PRECURSOR, AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2020/065499
Publication Date 02.04.2020
International Application No. PCT/IB2019/058051
International Filing Date 23.09.2019
IPC
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
C08L 101/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
H01L 23/3731
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3731Ceramic materials or glass
H01L 23/3737
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3737Organic materials with or without a thermoconductive filler
H01L 23/42
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • MIZOGUCHI GORGOLL, Ricardo
Agents
  • BRAMWELL, Adam M.
  • FLORCZAK, Yen Tong,
  • BLANK, Colene H.,
  • HARTS, Dean M. ,
  • LEVINSON, Eric D.,
  • MAKI, Eloise J.,
  • NOWAK, Sandra K.,
  • RINGSRED, Ted K.,
Priority Data
2018-18050726.09.2018JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THERMALLY CONDUCTIVE SHEET PRECURSOR, THERMALLY CONDUCTIVE SHEET OBTAINED FROM PRECURSOR, AND METHOD FOR MANUFACTURING SAME
(FR) PRÉCURSEUR DE FEUILLE THERMOCONDUCTRICE, FEUILLE THERMOCONDUCTRICE OBTENUE À PARTIR DE CE PRÉCURSEUR, ET PROCÉDÉ DE FABRICATION ASSOCIÉ
Abstract
(EN)
A thermally conductive sheet precursor according to an embodiment of the present disclosure includes agglomerates in which anisotropic thermally conductive primary particles are agglomerated, an isotropic thermally conductive material different from the agglomerates and having an average particle diameter of about 20 µm or greater, and a binder resin. When a first pressure in a range from about 0.75 to about 12 MPa is applied to the thermally conductive sheet precursor, at least some the agglomerates disintegrate.
(FR)
Selon l'un de ses modes de réalisation, l'invention concerne un précurseur de feuille thermoconductrice comprenant : des agglomérats dans lesquels des particules primaires thermoconductrices anisotropes sont agglomérées, un matériau thermoconducteur isotrope différent des agglomérats et possédant un diamètre moyen de particule d'environ 20 µm ou plus, ainsi qu'une résine liante. Lorsqu'une première pression, se situant dans une plage d'environ 0,75 à environ 12 MPa, est appliquée sur le précurseur de feuille thermoconductrice, au moins certains des agglomérats se désintègrent.
Also published as
Latest bibliographic data on file with the International Bureau