Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020065307 - THERMOELECTRIC DEVICE

Publication Number WO/2020/065307
Publication Date 02.04.2020
International Application No. PCT/GB2019/052701
International Filing Date 25.09.2019
IPC
H01L 35/34 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 35/16 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
14using inorganic compositions
16comprising tellurium or selenium or sulfur
H01L 35/26 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
26using compositions changing continuously or discontinuously inside the material
CPC
H01L 35/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
14using inorganic compositions
16comprising tellurium or selenium or sulfur
H01L 35/26
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
26using compositions changing continuously or discontinuously inside the material
H01L 35/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
34Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof
Applicants
  • CAMBRIDGE DISPLAY TECHNOLOGY LIMITED [GB]/[GB] (MG)
  • SUMITOMO CHEMICAL COMPANY LIMITED [JP]/[JP]
Inventors
  • FLETCHER, Thomas
  • KING, Simon
  • KOOMAR-POKHOT, Wichita
Agents
  • PJANOVIC, Ilija
Priority Data
1815883.228.09.2018GB
1818208.908.11.2018GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THERMOELECTRIC DEVICE
(FR) DISPOSITIF THERMOÉLECTRIQUE
Abstract
(EN)
A double layered, flexible thermoelectric generator with direct bonded, double layers of active materials that are directly bonded by heat curing, not soldered nor attached/bonded by an adhesive layer. The thermoelectric device is made from a first substrate and a second substrate, each including an n-type and p-type thermoelectric legs. The first and the second substrate are brought together so that the n-type and p-type thermoelectric legs of the first substrate come into direct contact with, respectively, the n-type and the p-type thermoelectric legs of the second substrate. Each thermoelectric leg may be disposed in a well formed in an insulating layer disposed over contact electrodes supported on the first and second substrate. Each thermoelectric leg may contain a particulate semiconductor and a binder, e.g. a polymer binder. The pairs of legs are bonded together by heat curing.
(FR)
La présente invention concerne un générateur thermoélectrique flexible à double couche avec des couches doubles à liaison directe de matériaux actifs qui sont directement liés par thermodurcissement, qui ne sont pas soudés ni fixés/liés par une couche adhésive. Le dispositif thermoélectrique est constitué d'un premier substrat et d'un second substrat, comprenant chacun des pattes thermoélectriques de type n et de type p. Les premier et second substrats sont rapprochés de telle sorte que les pattes thermoélectriques de type n et de type p du premier substrat entrent en contact direct avec, respectivement, les pattes thermoélectriques de type n et de type p du second substrat. Chaque patte thermoélectrique peut être disposée dans un puits formé dans une couche isolante disposée sur des électrodes de contact supportées sur le premier et le second substrat. Chaque patte thermoélectrique peut contenir un semi-conducteur particulaire et un liant, par exemple un liant polymère. Les paires de pattes sont liées ensemble par thermodurcissement.
Latest bibliographic data on file with the International Bureau