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1. WO2020064282 - METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Publication Number WO/2020/064282
Publication Date 02.04.2020
International Application No. PCT/EP2019/073535
International Filing Date 04.09.2019
Chapter 2 Demand Filed 23.04.2020
IPC
B24B 37/08 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
08for double side lapping
B24B 37/10 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
10for single side lapping
B24D 3/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
B24D 18/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
18Manufacture of grinding tools, e.g. wheels, not otherwise provided for
B24B 37/26 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
26characterised by the shape of the lapping pad surface, e.g. grooved
CPC
B24B 37/08
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
08for double side lapping
B24B 37/10
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
10for single side lapping
B24B 37/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
12Lapping plates for working plane surfaces
B24B 37/14
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
12Lapping plates for working plane surfaces
14characterised by the composition or properties of the plate materials
B24B 37/24
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
24characterised by the composition or properties of the pad materials
B24B 37/26
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
26characterised by the shape of the lapping pad surface, e.g. grooved
Applicants
  • SILTRONIC AG [DE]/[DE]
Inventors
  • RÖTTGER, Klaus
  • HEILMAIER, Alexander
Priority Data
10 2018 216 304.925.09.2018DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUM POLIEREN EINER HALBLEITERSCHEIBE
(EN) METHOD FOR POLISHING A SEMICONDUCTOR WAFER
(FR) PROCÉDÉ DE POLISSAGE D'UNE PLAQUETTE DE SEMI-CONDUCTEUR
Abstract
(DE)
Verfahren zum Polieren einer Halbleiterscheibe, indem wenigstens eine Seite der Halbleiterscheibe in Gegenwart eines Poliermittels gegen ein auf einem sich drehenden Polierteller befestigtes Poliertuch gedrückt wird, wobei das Poliertuch eine durch Kanäle unterbrochene Oberfläche ausweist, dadurch gekennzeichnet, dass das Poliertuch auf dem Polierteller befestigt wird, indem das Poliertuch auf dem Polierteller aufgeklebt und mittels eines geeigneten Werkzeugs im Bereich der Kanäle an den Polierteller gepresst wird.
(EN)
The invention relates to a method for polishing a semiconductor wafer in that at least one side of the semiconductor wafer is pressed against a polishing pad secured to a rotating polishing disc in the presence of a polishing agent. The polishing pad has a surface interrupted by channels. The invention is characterized in that the polishing pad is secured to the polishing disc in that the polishing pad is adhered to the polishing disc and is pressed against the polishing disc in the region of the channels by means of a suitable tool.
(FR)
Procédé de polissage d’une plaquette de semi-conducteur, dans lequel au moins une face de la plaquette de semi-conducteur est pressée en présence d’un agent de polissage contre une étoffe de polissage fixée à une plaque de polissage rotative, l'étoffe de polissage présentant une surface entrecoupée de canaux, caractérisé en ce que l'étoffe de polissage est fixée sur la plaque de polissage en collant l'étoffe de polissage sur la plaque de polissage et en pressant l'étoffe de polissage contre la plaque de polissage dans la zone des canaux au moyen d’un outil approprié.
Also published as
Latest bibliographic data on file with the International Bureau