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1. WO2020063643 - CIRCUIT BOARD STRUCTURE AND ELECTRONIC DEVICE

Publication Number WO/2020/063643
Publication Date 02.04.2020
International Application No. PCT/CN2019/107751
International Filing Date 25.09.2019
IPC
H05K 1/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
CPC
H05K 1/144
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
144Stacked arrangements of planar printed circuit boards
H05K 1/183
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
182associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
183Components mounted in and supported by recessed areas of the printed circuit board
H05K 2201/042
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
04Assemblies of printed circuits
042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
H05K 2201/09036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09009Substrate related
09036Recesses or grooves in insulating substrate
Applicants
  • 维沃移动通信有限公司 VIVO MOBILE COMMUNICATION CO., LTD. [CN]/[CN]
Inventors
  • 沈建伟 SHEN, Jianwei
Agents
  • 北京银龙知识产权代理有限公司 DRAGON INTELLECTUAL PROPERTY LAW FIRM
Priority Data
201811156325.329.09.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CIRCUIT BOARD STRUCTURE AND ELECTRONIC DEVICE
(FR) STRUCTURE À CARTES DE CIRCUIT IMPRIMÉ ET DISPOSITIF ÉLECTRONIQUE
(ZH) 电路板结构及电子设备
Abstract
(EN)
A circuit board structure, comprising a first circuit board (110) and a second circuit board (120) arranged on a board face of the first circuit board (110). At least one of the first circuit board (110) and the second circuit board (120) is provided with a groove (121). The first circuit board (110) and the second circuit board (120) are fixedly welded and form, within the groove (121), an accommodating space (130) for accommodating an electronic component. An electronic device is further comprised.
(FR)
Structure à cartes de circuit imprimé, comprenant une première carte de circuit imprimé (110) et une seconde carte de circuit imprimé (120) disposée sur une face de la première carte de circuit imprimé (110). La première carte de circuit imprimé (110) et/ou la seconde carte de circuit imprimé (120) est/sont pourvue-s d’une rainure (121). La première carte de circuit imprimé (110) et la seconde carte de circuit imprimé (120) sont soudées fixement et forment, dans les limites de la rainure (121), un espace logement (130) destiné à recevoir un composant électronique. L’invention concerne en outre un dispositif électronique.
(ZH)
一种电路板结构,包括第一电路板(110)和设置在所述第一电路板(110)上的板面上的第二电路板(120),所述第一电路板(110)和所述第二电路板(120)中至少一者具有凹槽(121),所述第一电路板(110)与所述第二电路板(120)焊接固定、且在所述凹槽(121)处形成用于容纳电子元器件的容纳空间(130)。还包括一种电子设备。
Also published as
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