Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020063237 - METHOD AND DEVICE FOR ADJUSTING EVAPORATION POSITION OF FILM MATERIAL

Publication Number WO/2020/063237
Publication Date 02.04.2020
International Application No. PCT/CN2019/102797
International Filing Date 27.08.2019
IPC
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/50 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
CPC
H01L 51/0012
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0012special provisions for the orientation or alignment of the layer to be deposited
H01L 51/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 黄炜赟 HUANG, Weiyun
Agents
  • 中国专利代理(香港)有限公司 CHINA PATENT AGENT (H.K.) LTD.
Priority Data
201811141088.328.09.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) METHOD AND DEVICE FOR ADJUSTING EVAPORATION POSITION OF FILM MATERIAL
(FR) PROCÉDÉ ET DISPOSITIF D'AJUSTEMENT DE POSITION D'ÉVAPORATION DE MATÉRIAU EN FILM
(ZH) 用于调整膜材蒸镀位置的方法和装置
Abstract
(EN)
Disclosed are a method and a device for adjusting an evaporation position of a film material in a film material evaporation process utilizing a mask plate assembly. The mask plate assembly comprises a mask plate fixing frame and a mask plate body fixed on the mask plate fixing frame. The method comprises: acquiring first offset displacements between a plurality of second mark points on the mask plate assembly and a plurality of first mark points on the mask plate body; acquiring second offset displacements between a plurality of third mark points on a substrate and the plurality of second mark points on the mask plate assembly, wherein the plurality of third mark points are formed from the plurality of second mark points on the substrate when the mask plate assembly is used to evaporate a film material on the substrate; determining, according to the first offset displacements and the second offset displacements, an actual offset displacement between an actual formation position and a preset formation position of the film material; and adjusting the preset formation position of the film material according to the actual offset displacement between the actual formation position and the preset formation position of the film material.
(FR)
L'invention concerne un procédé et un dispositif destinés à ajuster une position d'évaporation d'un matériau en film dans un processus d'évaporation de matériau en film à l'aide d'un ensemble plaque de masque. L'ensemble plaque de masque comprend un cadre de fixation de plaque de masque et un corps de plaque de masque fixé sur le cadre de fixation de plaque de masque. Le procédé consiste : à acquérir des premiers déplacements de décalage entre une pluralité de deuxièmes points de repère sur l'ensemble plaque de masque et une pluralité de premiers points de repère sur le corps de plaque de masque ; à acquérir des seconds déplacements de décalage entre une pluralité de troisièmes points de repère sur un substrat et la pluralité de deuxièmes points de repère sur l'ensemble plaque de masque, la pluralité de troisièmes points de repère étant formés à partir de la pluralité de deuxièmes points de repère sur le substrat lorsque l'ensemble plaque de masque est utilisé pour l'évaporation d'un matériau en film sur le substrat ; à déterminer, en fonction des premiers déplacements de décalage et des seconds déplacements de décalage, un déplacement de décalage actuel entre une position de formation actuelle et une position de formation prédéfinie du matériau en film ; et à ajuster la position de formation prédéfinie du matériau en film en fonction du déplacement de décalage actuel entre la position de formation actuelle et la position de formation prédéfinie du matériau en film.
(ZH)
公开了在利用掩模板组件的蒸镀膜材工艺中调整膜材蒸镀位置的方法和装置,其中所述掩模板组件包括掩模板固定框架以及固定在所述掩模板固定框架上的掩模板本体。该方法包括:获取掩模板组件上的多个第二标记点与掩模板本体上的多个第一标记点之间的第一偏移位移;获取基板上的多个第三标记点与掩模板组件上的多个第二标记点之间的第二偏移位移,其中所述多个第三标记点是当采用所述掩模板组件在所述基板上蒸镀膜材时由所述多个第二标记点在所述基板上形成的;根据所述第一偏移位移和所述第二偏移位移,确定所述膜材的实际形成位置与预设形成位置之间的实际偏移位移;以及根据所述膜材的实际形成位置与预设形成位置之间的实际偏移位移,对所述膜材的预设形成位置进行调整。
Also published as
Latest bibliographic data on file with the International Bureau