Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020062915 - CAMERA ASSEMBLY, ASSEMBLY METHOD THEREFOR, AND TERMINAL

Publication Number WO/2020/062915
Publication Date 02.04.2020
International Application No. PCT/CN2019/090232
International Filing Date 06.06.2019
IPC
H01L 27/146 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
H04N 5/225 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
CPC
H01L 27/14634
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14634Assemblies, i.e. Hybrid structures
H01L 27/1469
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
1469Assemblies, i.e. hybrid integration
H04N 5/2251
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
H04N 5/2253
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
H04N 5/2254
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2254Mounting of optical parts, e.g. lenses, shutters, filters or optical parts peculiar to the presence or use of an electronic image sensor
H04N 5/2257
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2257Mechanical and electrical details of cameras or camera modules for embedding in other devices
Applicants
  • 华为技术有限公司 HUAWEI TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 曹曦 CAO, Xi
  • 冉坤 RAN, Kun
  • 卿湘勇 QING, Xiangyong
Agents
  • 北京龙双利达知识产权代理有限公司 LONGSUN LEAD IP LTD.
Priority Data
201811155503.030.09.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CAMERA ASSEMBLY, ASSEMBLY METHOD THEREFOR, AND TERMINAL
(FR) ENSEMBLE CAMÉRA, SON PROCÉDÉ D'ASSEMBLAGE, ET TERMINAL
(ZH) 一种摄像头组件、组装方法以及终端
Abstract
(EN)
The present application provides a camera assembly and an assembly method therefor. The method comprises: plastically packaging a chip-type electronic component and an image sensor to form a target plastic package module, the target plastic package module comprising an active surface, and both the welded end of the chip-type electronic component and the welded end of the image sensor are exposed on the active surface; forming a redistribution layer (RDL), drilling the RDL to form a through hole, the RDL comprising a dielectric layer and a metal wiring located in the dielectric layer, and connecting metal wiring exposed on a first surface of the RDL to the welded ends on the active surface of the target plastic package module. The technical solution provided in the embodiments of the present application can achieve the electrical connection of the electronic components by means of the metal wiring in the RDL, so that the overall height of the camera module is lowered.
(FR)
La présente invention concerne un ensemble caméra et son procédé d'assemblage. Le procédé consiste : à emballer dans du plastique un composant électronique de type puce et un capteur d'image pour former un module d'emballage en plastique cible, le module d'emballage en plastique cible comprenant une surface active, et à la fois l'extrémité soudée du composant électronique de type puce et l'extrémité soudée du capteur d'image sont apparentes sur la surface active ; à former une couche de redistribution (RDL), à percer la RDL pour former un trou traversant, la RDL comprenant une couche diélectrique et un câblage métallique situé dans la couche diélectrique, et à connecter un câblage métallique apparent sur une première surface de la RDL aux extrémités soudées sur la surface active du module d'emballage en plastique cible. La solution technique prévue dans les modes de réalisation de la présente invention peut réaliser la connexion électrique des composants électroniques au moyen du câblage métallique dans la RDL, de telle sorte que la hauteur globale du module de caméra est abaissée.
(ZH)
本申请提供了一种摄像头组件及组装方法,该方法包括:对贴片式的电子元件以及图像传感器进行塑封,形成目标塑封模块,所述目标塑封模块包括有源面,所述贴片式的电子元件的焊端以及图像传感器的焊端均裸露在所述有源面上;制备重布线层RDL,对所述RDL进行钻孔处理,形成通孔,所述RDL包括介质层和位于所述介质层内的金属布线,将裸露在所述RDL的第一表面的所述金属布线与所述目标塑封模块的有源面上的焊端连接在一起。本申请实施例提供的技术方案可以通过RDL中的金属布线实现电子元器件的电气连接,从而整体降低摄像头模组的高度。
Also published as
Latest bibliographic data on file with the International Bureau