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1. WO2020062869 - FINGERPRINT SENSING DEVICE AND MANUFACTURING METHOD THEREFOR

Publication Number WO/2020/062869
Publication Date 02.04.2020
International Application No. PCT/CN2019/085663
International Filing Date 06.05.2019
IPC
G06K 9/00 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
H01L 27/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
CPC
G06K 9/00013
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
G06K 9/00973
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00973Hardware and software architectures for pattern recognition, e.g. modular organisation
H01L 27/1421
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
142Energy conversion devices
1421comprising bypass diodes integrated or directly associated with the device, e.g. bypass diode integrated or formed in or on the same substrate as the solar cell
Applicants
  • 武汉华星光电技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 颜源 YAN, Yuan
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201811135390.828.09.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FINGERPRINT SENSING DEVICE AND MANUFACTURING METHOD THEREFOR
(FR) DISPOSITIF DE RECONNAISSANCE D'EMPREINTE DIGITALE ET SON PROCÉDÉ DE FABRICATION
(ZH) 指纹感测装置及其制造方法
Abstract
(EN)
A panel identification technique, especially a fingerprint sensing device and a manufacturing method therefor. The device comprises: a pixel substrate on which a plurality of sensing pixel units is formed, wherein each sensing pixel unit is provided with an identification region and a reading region, and each sensing pixel unit comprises: a patterned light shielding layer provided in the identification region and the reading region; a polysilicon layer provided on the patterned light shielding layer; a gate layer provided on the polysilicon layer in the reading region; a patterned dielectric layer provided on the gate layer in the read region; a metal oxide layer provided on the polysilicon layer in the identification region; and a source-drain metal film layer provided on the metal oxide layer in the identification region and on the patterned dielectric layer in the reading region, thereby achieving the beneficial effect of no complicated film formation and photolithography process and high resolution.
(FR)
L'invention concerne une technique d'identification de panneau, en particulier un dispositif de détection d'empreinte digitale et son procédé de fabrication. Le dispositif comprend : un substrat de pixel sur lequel est formée une pluralité d'unités de pixel de détection, chaque unité de pixel de détection étant pourvue d'une région d'identification et d'une région de lecture, et chaque unité de pixel de détection comprenant : une couche de protection contre la lumière à motifs disposée dans la région d'identification et la région de lecture; une couche de polysilicium disposée sur la couche de protection contre la lumière à motifs; une couche de grille disposée sur la couche de polysilicium dans la région de lecture; une couche diélectrique à motifs disposée sur la couche de grille dans la région de lecture; une couche d'oxyde métallique disposée sur la couche de polysilicium dans la région d'identification; et une couche de film métallique de source-drain disposée sur la couche d'oxyde métallique dans la région d'identification et sur la couche diélectrique à motifs dans la région de lecture, ce qui permet d'obtenir l'effet bénéfique d'une formation de film compliquée et d'un processus de photolithographie et d'une haute résolution.
(ZH)
一种面板识别技术,尤其指一种指纹感测装置及其制造方法,所述装置包括:一像素基板,其上形成多个感测像素单元,各所述感测像素单元具有一识别区与一读取区,各所述感测像素单元包括:一图案化遮光层,设置于所述识别区与读取区;一多晶硅层,设置于所述图案化遮光层上;一栅极层,设置于所述读取区内的所述多晶硅层上;一图案化介电层,设置于所述读取区内的所述栅极层上;一金属氧化物层,设置于所述识别区内的所述多晶硅层上;以及一源漏极金属膜层,设置于所述识别区内的所述金属氧化物层上与所述读取区内的所述图案化介电层上,达到无需复杂的成膜与光刻工艺且分辨率较高的有益效果。
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