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1. WO2020062845 - MICRO-LED CHIP, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS

Publication Number WO/2020/062845
Publication Date 02.04.2020
International Application No. PCT/CN2019/083546
International Filing Date 19.04.2019
IPC
H01L 27/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
CPC
H01L 21/77
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
H01L 27/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
Applicants
  • 昆山工研院新型平板显示技术中心有限公司 KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD. [CN]/[CN]
  • 昆山国显光电有限公司 KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. [CN]/[CN]
Inventors
  • 翟峰 ZHAI, Feng
  • 刘会敏 LIU, Huimin
  • 王涛 WANG, Tao
Agents
  • 广州华进联合专利商标代理有限公司 ADVANCE CHINA IP LAW OFFICE
Priority Data
201811133686.627.09.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MICRO-LED CHIP, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS
(FR) PUCE DE MICRO-DEL, SON PROCEDE DE PREPARATION ET APPAREIL D'AFFICHAGE
(ZH) Micro-LED芯片及其制备方法、显示装置
Abstract
(EN)
Disclosed in the present application are a micro-LED chip, a preparation method therefor and a display apparatus. The micro-LED chip comprises: a drive back plate which comprises at least one first electrode, wherein a groove is arranged above the first electrode, and the first electrode is located at a bottom part of the groove; the groove is filled with a conductive material, and the conductive material is obtained by curing a corresponding conductive ink; and a light-emitting chip which comprises at least one second electrode, the first electrode being connected to the second electrode by means of the conductive material.
(FR)
L’invention concerne une puce de micro-DEL, son procédé de préparation et un appareil d’affichage. La puce de micro-DEL comprend : une plaque arrière d'entraînement qui comprend au moins une première électrode, une rainure étant disposée au-dessus de la première électrode, et la première électrode étant située au niveau d'une partie inférieure de la rainure ; la rainure est remplie d'un matériau conducteur, et le matériau conducteur est obtenu par durcissement d'une encre conductrice correspondante ; et une puce électroluminescente qui comprend au moins une seconde électrode, la première électrode étant connectée à la seconde électrode au moyen du matériau conducteur.
(ZH)
本申请公开一种Micro-LED芯片及其制备方法、显示装置。该Micro-LED芯片包括:驱动背板,包括至少一个第一电极,第一电极上方设有凹槽,第一电极位于凹槽的底部;凹槽内填充有导电材料,导电材料由对应的导电墨水固化得到;和发光芯片,包括至少一个第二电极;第一电极通过导电材料与第二电极连接。
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