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1. WO2020062469 - MICROPHONE MODULE AND ELECTRONIC DEVICE

Publication Number WO/2020/062469
Publication Date 02.04.2020
International Application No. PCT/CN2018/114933
International Filing Date 10.11.2018
IPC
H04R 7/02 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers; Cones
02characterised by the construction
H04R 9/06 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
06Loudspeakers
CPC
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81B 7/0038
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
0035for maintaining a controlled atmosphere inside of the chamber containing the MEMS
0038using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
B81B 7/0048
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
0045for reducing stress inside of the package structure
0048between the MEMS die and the substrate
B81B 7/0061
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
0061suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
H04R 1/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
02Casings; Cabinets ; ; Supports therefor;; Mountings therein
04Structural association of microphone with electric circuitry therefor
H04R 1/08
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
08Mouthpieces; Microphones;; Attachments therefor
Applicants
  • 北京小米移动软件有限公司 BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. [CN]/[CN]
Inventors
  • 颜嘉甫 YEN, Chiafu
  • 杜慧 DU, Hui
Agents
  • 北京律智知识产权代理有限公司 BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD.
Priority Data
201811133959.727.09.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MICROPHONE MODULE AND ELECTRONIC DEVICE
(FR) MODULE DE MICROPHONE ET DISPOSITIF ÉLECTRONIQUE
(ZH) 麦克风模组、电子设备
Abstract
(EN)
Provided are a microphone module and an electronic device, relating to the technical field of electronic devices. The microphone module comprises: a housing, a circuit board, a signal converter, and an adhesion member, wherein a cavity and a sound receiving hole, which are in communication with each other, are formed in the housing; the circuit board is connected to the housing and blocks the cavity; the adhesion member is arranged inside the cavity; and the signal converter is used for converting a sound signal into an electrical signal, is electrically connected to the circuit board, and is arranged in the cavity. The microphone module provided in the present disclosure reduces the possibility of impurities coming into contact with a vibrating diaphragm by means of an adhesion member arranged in a cavity, thereby reducing the impact and abrasion caused by the impurities on the vibrating diaphragm, avoiding the damage of the vibrating diaphragm, ensuring the normal use of the microphone module, and contributing to prolonging the service life of the microphone module. (FIG. 1)
(FR)
L'invention concerne un module de microphone et un dispositif, se rapportant au domaine technique des dispositifs électroniques. Le module de microphone comprend : un boîtier, une carte de circuit imprimé, un convertisseur de signal, et un élément d'adhérence, une cavité et un trou de réception de son, qui sont en communication l'un avec l'autre, étant formés dans le boîtier ; la carte de circuit imprimé est connectée au boîtier et bloque la cavité ; l'élément d'adhérence est agencé à l'intérieur de la cavité ; et le convertisseur de signal est utilisé pour convertir un signal sonore en un signal électrique, est électriquement connecté à la carte de circuit imprimé, et est agencé dans la cavité. Le module de microphone selon la présente invention réduit la possibilité que des impuretés entrent en contact avec un diaphragme vibrant au moyen d'un élément d'adhérence agencé dans une cavité, réduisant ainsi l'impact et l'abrasion provoqués par les impuretés sur le diaphragme vibrant, évitant l'endommagement du diaphragme vibrant, assurant l'utilisation normale du module de microphone, et contribuant à prolonger la durée de vie du module de microphone. (FIG. 1)
(ZH)
本公开提供了一种麦克风模组、电子设备,涉及电子设备技术领域。该麦克风模组包括:外壳、电路板、信号转换器、以及粘附件。其中,外壳形成有相连通的腔体与收声孔;电路板与所述外壳相连,封堵所述腔体;粘附件设置在所述腔体内;信号转换器用于将声信号转换为电信号,与所述电路板电连接,置于所述腔体内。本公开提供的麦克风模组通过设置在腔体内的粘附件,降低了杂质接触振动膜片的可能性,进而减少杂质对振动膜片的冲击和磨损,避免振动膜片损坏,保障麦克风模组的正常使用,并有助于延长麦克风模组的使用寿命。 (图1)
Also published as
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