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1. WO2020062200 - HIGH-STRENGTH LOW-TEMPERATURE LEAD-FREE SOLDER AND PREPARATION METHOD THEREFOR

Publication Number WO/2020/062200
Publication Date 02.04.2020
International Application No. PCT/CN2018/108931
International Filing Date 30.09.2018
IPC
B23K 35/26 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400°C
B23K 35/40 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
40Making wire or rods for soldering or welding
CPC
B23K 35/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
B23K 35/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
40Making wire or rods for soldering or welding
Applicants
  • 苏州优诺电子材料科技有限公司 EUNOW ELECTRONIC TECHNOLOGY CO., LTD (SUZHOU) [CN]/[CN]
Inventors
  • 陈钦 CHEN, Qin
  • 罗登俊 LUO, Dengjun
  • 徐衡 XU, Heng
  • 陈旭 CHEN, Xu
Agents
  • 北京众合诚成知识产权代理有限公司 BEIJING ZHCC INTELLECTUAL PROPERTY CO., LTD
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) HIGH-STRENGTH LOW-TEMPERATURE LEAD-FREE SOLDER AND PREPARATION METHOD THEREFOR
(FR) BRASURE SANS PLOMB À BASSE TEMPÉRATURE HAUTE RÉSISTANCE ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 一种高强度低温无铅焊料及其制备方法
Abstract
(EN)
Disclosed is a high-strength low-temperature lead-free solder comprising the following components in parts by weight: 0.1-0.4 parts of nano titanium nitride, 0.05-0.1 parts of zirconium borate, 50-80 parts of an Sn-In alloy micropowder and 1-3 parts of a flux, wherein the Sn-In alloy micropowder comprises the following components in mass percentage: 30.5-59.5% of In, 0.1-0.5% of Cu, 0.03-0.05% of Ag, 0.001-0.002% of Cr, 0-0.001% of Co, 0.001-0.002% of La, 0.0005-0.001% of Y, 0.001-0.003% of Zn, 0.001-0.003% of Ti, and the balance being Sn and inevitable impurities. The lead-free solder contains no lead element, meets environmentally friendly requirements, and has good mechanical properties and an excellent solderability. The present invention also relates to a preparation method for the high-strength low-temperature lead-free solder.
(FR)
La présente invention concerne une brasure sans plomb à basse température haute résistance comprenant les composants suivants exprimés en parties en poids : 0,1 à 0,4 partie de nanonitrure de titane, 0,05 à 0,1 partie de borate de zirconium, 50 à 80 parties d'une micropoudre d'alliage Sn-In et 1 à 3 parties d'un flux, la micropoudre d'alliage Sn-In comprenant les composants suivants exprimés en pourcentage en masse : 30,5 à 59,5 % d'In, 0,1 à 0,5 % de Cu, 0,03 à 0,05 % d'Ag, 0,001 à 0,002 % de Cr, 0 à 0,001 % de Co, 0,001 à 0,002 % de La, 0,0005 à 0,001 % d'Y, 0,001 à 0,003 % de Zn, 0,001 à 0,003 % de Ti, le reste étant du Sn et des impuretés inévitables. La brasure sans plomb ne contient pas d'élément à base de plomb, répond aux exigences écologiques et présente de bonnes propriétés mécaniques ainsi qu'une excellente aptitude au brasage. La présente invention concerne également un procédé de préparation de la brasure sans plomb à basse température haute résistance.
(ZH)
一种高强度低温无铅焊料,以重量份计,包括以下组分:纳米氮化钛0.1-0.4份,硼酸锆0.05-0.1份,Sn-In系合金微粉50-80份,助焊剂1-3份,其中Sn-In系合金微粉,以质量百分比计,包括以下组分:In 30.5-59.5%,Cu 0.1-0.5%,Ag 0.03-0.05%,Cr 0.001-0.002%,Co 0-0.001%,La 0.001-0.002%,Y 0.0005-0.001%,Zn 0.001-0.003%,Ti 0.001-0.003%,余量为Sn和不可避免的杂质。该无铅焊料不含铅元素,符合环保要求,且机械性能好,可焊性优异。还涉及一种高强度低温无铅焊料的制备方法。
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