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1. WO2020062140 - CHIP PACKAGING STRUCTURE, METHOD, AND ELECTRONIC DEVICE

Publication Number WO/2020/062140
Publication Date 02.04.2020
International Application No. PCT/CN2018/108625
International Filing Date 29.09.2018
IPC
H01L 27/146 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
CPC
G06K 9/0004
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
0004by using electro-optical elements or layers, e.g. electroluminescent sensing
H01L 27/14634
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14634Assemblies, i.e. Hybrid structures
H01L 27/1469
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
1469Assemblies, i.e. hybrid integration
Applicants
  • 深圳市汇顶科技股份有限公司 SHENZHEN GOODIX TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 吴宝全 WU, Baoquan
  • 蒋万里 JIANG, Wanli
Agents
  • 北京龙双利达知识产权代理有限公司 LONGSUN LEAD IP LTD.
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CHIP PACKAGING STRUCTURE, METHOD, AND ELECTRONIC DEVICE
(FR) STRUCTURE ET PROCÉDÉ D’ENCAPSULATION DE PUCE ET DISPOSITIF ÉLECTRONIQUE
(ZH) 芯片封装结构、方法和电子设备
Abstract
(EN)
Disclosed are a chip packaging structure, a method, and an electronic device, relating to the technical field of chip packaging. The chip packaging structure comprises a substrate, a connector, an image sensing module and an auxiliary module, and the image sensing module and the auxiliary module are integrally packaged by means of the substrate; the image sensing module comprises an image sensing chip, and the image sensing chip is packaged on a first surface of the substrate; the auxiliary module comprises at least one optical auxiliary chip, and the at least one optical auxiliary chip is packaged on a second surface of the substrate, and is electrically connected to the image sensing chip by means of the substrate; and the connector is connected to the substrate for electrically connecting the chip packaging structure to an external unit. The embodiments of the present disclosure can improve the integration of a chip packaging module and reduce the total volume of the module.
(FR)
L'invention concerne une structure et un procédé d'encapsulation de puce, et un dispositif électronique, qui se rapportent au domaine technique de l'encapsulation de puce. La structure d'encapsulation de puce comprend un substrat, un connecteur, un module de détection d'image et un module auxiliaire, et le module de détection d'image et le module auxiliaire sont encapsulés d'un seul tenant au moyen du substrat ; le module de détection d'image comprend une puce de détection d'image, et la puce de détection d'image est encapsulée sur une première surface du substrat ; le module auxiliaire comprend au moins une puce auxiliaire optique, et ladite puce auxiliaire optique est encapsulée sur une seconde surface du substrat, et est électriquement connectée à la puce de détection d'image au moyen du substrat ; et le connecteur est connecté au substrat pour connecter électriquement la structure d'encapsulation de puce à une unité externe. Les modes de réalisation de la présente invention peuvent améliorer l'intégration d'un module d'encapsulation de puce et réduire le volume total du module.
(ZH)
本公开涉及芯片封装技术领域,公开了一种芯片封装结构、方法和电子设备。所述芯片封装结构包括基板、连接器、影像传感模块和辅助模块,所述影像传感模块和所述辅助模块利用所述基板进行一体式封装;所述影像传感模块包括影像传感芯片,所述影像传感芯片封装在所述基板的第一表面;所述辅助模块包括至少一个光学辅助芯片,所述至少一个光学辅助芯片封装在所述基板的第二表面,并通过所述基板与所述影像传感芯片进行电性连接;所述连接器连接在所述基板上,用于供所述芯片封装结构与外界单元进行电性连接。本公开实施例可以提高芯片封装模组的集成度并降低模组的总体积。
Also published as
CN201880001868.X
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