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1. WO2020061823 - OPTICAL IMAGE ACQUISITION UNIT, OPTICAL IMAGE ACQUISITION APPARATUS AND ELECTRONIC DEVICE

Publication Number WO/2020/061823
Publication Date 02.04.2020
International Application No. PCT/CN2018/107630
International Filing Date 26.09.2018
IPC
H01L 27/146 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
G06K 9/00 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
CPC
G06K 9/0004
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
0004by using electro-optical elements or layers, e.g. electroluminescent sensing
H01L 27/14612
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14609Pixel-elements with integrated switching, control, storage or amplification elements
14612involving a transistor
H01L 27/14627
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14625Optical elements or arrangements associated with the device
14627Microlenses
H01L 27/14634
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14634Assemblies, i.e. Hybrid structures
H01L 27/3234
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3225OLED integrated with another component
3234the other component being an imager structure
Applicants
  • 深圳市汇顶科技股份有限公司 SHENZHEN GOODIX TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 胡勇 HU, Yong
  • 龙卫 LONG, Wei
  • 柳玉平 LIU, Yuping
Agents
  • 北京龙双利达知识产权代理有限公司 LONGSUN LEAD IP LTD.
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) OPTICAL IMAGE ACQUISITION UNIT, OPTICAL IMAGE ACQUISITION APPARATUS AND ELECTRONIC DEVICE
(FR) UNITÉ D'ACQUISITION D'IMAGE OPTIQUE, APPAREIL D'ACQUISITION D'IMAGE OPTIQUE ET DISPOSITIF ÉLECTRONIQUE
(ZH) 光学图像采集单元、光学图像采集装置和电子设备
Abstract
(EN)
An optical image acquisition unit (200), an optical image acquisition apparatus and an electronic device (100). The optical image acquisition unit (200) comprises: a microlens (210); a light blocking layer (220) arranged below the microlens (210), wherein the light blocking layer (220) is provided with a via hole (221) located below the microlens (210) and passing through the light blocking layer (220); and a photoelectric sensor (230) arranged below the light blocking layer (220), wherein the photoelectric sensor (230) comprises a thin film transistor (240) and a photodiode (250); the microlens (210) is used for converging optical signals from above the microlens (210) to the via hole (221), and the optical signals are transmitted to the photodiode (250) via the via hole (221); and the photodiode (250) is used for converting the optical signals into electrical signals and transmitting the electrical signals to the thin film transistor (240). The microlens (210) converging the optical signals from above the microlens (210) to the via hole (221), and transmitting the optical signals to the photoelectric sensor (230) via the via hole (221) to realize image acquisition can improve the performance of an optical image acquisition product.
(FR)
L'invention concerne une unité d'acquisition d'image optique (200), un appareil d'acquisition d'image optique et un dispositif électronique (100). L'unité d'acquisition d'image optique (200) comprend : une microlentille (210) ; une couche de blocage de lumière (220) disposée au-dessous de la microlentille (210), la couche de blocage de lumière (220) étant pourvue d'un trou de raccordement (221) situé au-dessous de la microlentille (210) et traversant la couche de blocage de lumière (220) ; et un capteur photoélectrique (230) disposé au-dessous de la couche de blocage de lumière (220), le capteur photoélectrique (230) comprend un transistor en couches minces (240) et une photodiode (250) ; la microlentille (210) est utilisée pour faire converger des signaux optiques depuis le dessus de la microlentille (210) vers le trou de raccordement (221), et les signaux optiques sont transmis à la photodiode (250) par l'intermédiaire du trou de raccordement (221) ; et la photodiode (250) est utilisée pour convertir les signaux optiques en signaux électriques et transmettre les signaux électriques au transistor en couches minces (240). La microlentille (210) faisant converger les signaux optiques depuis le dessus de la microlentille (210) vers le trou de raccordement (221), et transmettant les signaux optiques au capteur photoélectrique (230) par l'intermédiaire du trou de raccordement (221) pour réaliser une acquisition d'image peut améliorer les performances d'un produit d'acquisition d'image optique.
(ZH)
一种光学图像采集单元(200)、光学图像采集装置和电子设备(100)。所述光学图像采集单元(200),包括:微镜头(210);挡光层(220),设置于所述微镜头(210)下方,所述挡光层(220)设置有位于所述微镜头(210)下方的贯通所述挡光层(220)的过孔(221);光电传感器(230),设置于所述挡光层(220)下方;其中,所述光电传感器(230)包括薄膜晶体管(240)和光电二极管(250),所述微镜头(210)用于将来自所述微镜头(210)上方的光信号汇聚至所述过孔(221),所述光信号经由所述过孔(221)传输至所述光电二极管(250),所述光电二极管(250)用于将所述光信号转换为电信号,并将所述电信号传输至所述薄膜晶体管(240)。通过微镜头(210)将来自微镜头(210)上方的光信号汇聚至过孔(221),并使光信号经由过孔(221)传输至光电传感器(230)以实现图像采集,能够提升光学图像采集产品的性能。
Also published as
CN201880001635.X
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