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1. WO2020009087 - PHOTOSENSITIVE RESIN COMPOSITION

Publication Number WO/2020/009087
Publication Date 09.01.2020
International Application No. PCT/JP2019/026215
International Filing Date 02.07.2019
IPC
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
C08G 59/40 (2006.01)
G03F 7/004 (2006.01)
G03F 7/038 (2006.01)
H05K 3/28 (2006.01)
CPC
C08G 59/40
G03F 7/004
G03F 7/038
H05K 3/28
Applicants
  • 日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP/JP]; 東京都千代田区丸の内二丁目1番1号 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005, JP
Inventors
  • 寺田 究 TERADA Kiwamu; JP
  • 桑原 博一 KUWABARA Hirokazu; JP
Agents
  • 上村 陽一郎 KAMIMURA Yoichiro; JP
Priority Data
2018-12793805.07.2018JP
2019-04568613.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE
(JA) 感光性樹脂組成物
Abstract
(EN)
The purpose of the present invention is to provide a resin composition that exhibits a high storage stability in single-package form and that exhibits excellent properties and electrical characteristics for the cured product therefrom. Namely, provided are a resin composition comprising (A) a photobase generator comprising a compound represented by formula (1) (In formula (1), R1, R2, R3, R5, and R6 each independently represent, e.g., a hydrogen atom, hydroxyl group, alkoxy group, or organic group other than the preceding substituents. At least one of R4 represents an organic group that contains a thioether bond, and the other represents a hydrogen atom or an organic group that contains a thioether bond. The A represents a substituent represented by formula (1-1) or (1-2) (In formula (1-1), R7 and R8 each independently represent, e.g., a hydrogen atom, alkyl group, or heterocyclic group. In formula (1-2), R9 and R10 each independently represent an amino group or a substituted amino group.)), (B) an alkali-developable resin, and (C) a thermally reactive compound.
(FR)
Le but de la présente invention est de fournir une composition de résine qui présente une stabilité de stockage élevée sous une forme d'emballage unique et qui présente d'excellentes propriétés et caractéristiques électriques pour le produit durci à partir de celle-ci. Plus précisément, l'invention concerne une composition de résine comprenant (A) un générateur de photobases comprenant un composé représenté par la formule (1) (dans la formule (1), R1, R2, R3, R5 et R6 représentent chacun indépendamment, par exemple, un atome d'hydrogène, un groupe hydroxyle, un groupe alcoxy ou un groupe organique autre que les substituants précédents. Au moins l'un de R4 représente un groupe organique qui contient une liaison thioéther, et l'autre représente un atome d'hydrogène ou un groupe organique qui contient une liaison thioéther. A représente un substituant représenté par la formule (1-1) ou (1-2) (dans la formule (1-1), R7 et R8 représentent chacun indépendamment par exemple un atome d'hydrogène, un groupe alkyle ou un groupe hétérocyclique. Dans la formule (1-2), R9 et R10 représentent chacun indépendamment un groupe amino ou un groupe amino substitué)), (B) une résine développable en milieu alcalin et (C) un composé thermiquement réactif.
(JA)
一液での保存安定性が高く、硬化物の物性及び電気特性に優れる樹脂組成物を提供することを目的とするものである。すなわち、 (A)下記式(1)(式(1)中、R、R、R、R及びRはそれぞれ独立に、水素原子、水酸基、アルコキシ基又は前記の置換基以外の有機基等を表す。Rの少なくとも一方はチオエーテル結合を含む有機基は、他方は水素原子又はチオエーテル結合を含む有機基を表す。Aは下記式(1-1)又は(1-2)(式(1-1)中、R及びRは、それぞれ独立に水素原子、アルキル基若しくは複素環基等を表す。式(1-2)中、R及びR10はそれぞれ独立にアミノ基又は置換アミノ基を表す。)で表される置換基を表す。)で表される化合物を含む光塩基発生剤、(B)アルカリ現像性樹脂及び(C)熱反応性化合物を含有する樹脂組成物が提供される。
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